Browsing by Author Dow, W.P.

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20093-Mercapto-1-propanesulfonic acid and Bis(3-sulfopropyl) Disulfide Adsorbed on Au(111): In Situ Scanning Tunneling Microscopy and Electrochemical StudiesJian, Z.Y.; 竇維平; Chang, T.Y.; Yang, Y.C.; Dow, W.P.; Yau, S.L.; Lee, Y.L.-
2007Adlayer structure and copper deposition of a Au(111) electrode modified by bis(3-sulfopropyl) disfulride and mercaptopropylsulfonic acidCheng, T.Y.; Yang, Y.C.; Dow, W.P.; Lee, Y.L.-
2009Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various LevelersDow, W.P.; 竇維平; Li, C.C.; Lin, M.W.; Su, G.W.; Huang, C.C.-
2010Effect of Chloride Ions on the Adsorption of 3-Mercapto-1-propanesulfonic acid and Bis(3-sulfopropyl)-disulfide on a Au(111) SurfaceLiu, Y.F.; 竇維平; Lee, Y.L.; Yang, Y.C.; Jian, Z.Y.; Dow, W.P.; Yau, S.L.-
2012Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating SolutionHuang, S.M.; Liu, C.W.; Dow, W.P.-
2008Enhancement of filling performance of a copper plating formula at low chloride concentrationDow, W.P.; 竇維平; Yen, M.Y.; Liu, C.W.; Huang, C.C.-
2008Filling mechanism in microvia metallization by copper electroplatingDow, W.P.; 竇維平; Yen, M.Y.; Liao, S.Z.; Chiu, Y.D.; Huang, H.C.-
2011In Situ Scanning Tunneling Microscopy Study of 3-Mercaptopropanesulfonate Adsorbed on Pt(111) and Electrodeposition of Copper in 0.1 M KClO4+1 mM HCl (pH 3)Yen, P.Y.; Tu, H.L.; Wu, H.L.; Chen, S.Z.; Vogel, W.; Yau, S.L.; Dow, W.P.-
2010In Situ STM of 3-Mercaptopropanesulfonate Adsorbed on Pt(111) Electrode and Its Effect on the Electrodeposition of CopperTu, H.L.; 竇維平; Yen, P.Y.; Wu, H.L.; Chen, S.; Vogel, W.; Yau, S.; Dow, W.P.-
2010In Situ STM Revelation of the Adsorption and Polymerization of Aniline on Au(111) Electrode in Perchloric Acid and Benzenesulfonic AcidLee, Y.; 竇維平; Chen, S.; Tu, H.; Yau, S.; Fan, L.J.; Yang, Y.W.; Dow, W.P.-
2012In Situ STM Study of Cu Electrodeposition on TBPS-Modified Au(111) ElectrodesLiu, Y.F.; Krug, K.; Lin, P.C.; Chiu, Y.D.; Dow, W.P.; Yau, S.L.; Lee, Y.L.-
2009Microvia filling by copper electroplating using diazine black as a levelerDow, W.P.; 竇維平; Li, C.C.; Su, Y.C.; Shen, S.P.; Huang, C.C.; Lee, C.; Hsu, B.; Hsu, S.-
2009Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a DisulfideDow, W.P.; 竇維平; Chiu, Y.D.; Yen, M.Y.-
2010Modification of Cu nanoparticles with a disulfide for polyimide metallizationDow, W.P.; 竇維平; Liao, G.L.; Huang, S.E.; Chen, S.W.-
2009Publisher's Note: Microvia Filling by Cu Electroplating over a Au Seed Layer Modified by a Disulfide J. Electrochem. Soc., 156, D155 (2009)Dow, W.P.; Chiu, Y.D.; Yen, M.Y.-
2009Revelation of the spatial structures and polymerization of aniline on Au(100) electrode by in situ scanning tunnelling microscopyYau, S.L.; 竇維平; Lee, Y.H.; Chang, C.Z.; Dow, W.P.-
2011Scanning Tunneling Microscopy and Cyclic Voltammetry Study of Self-Assembled 3,3 '-Thiobis(1-propanesulfonic acid, sodium salt) Monolayers on Au(111) ElectrodesLiu, Y.F.; 竇維平; Krug, K.; Lin, P.C.; Chiu, Y.D.; Lee, Y.L.; Dow, W.P.-
2009Structures of Aniline and Polyaniline Molecules Adsorbed on Au(111) Electrode: as Probed by in Situ STM, ex Situ XPS, and NEXAFSYau, S.L.; 竇維平; Lee, Y.H.; Chang, C.Z.; Fan, L.J.; Yang, Y.W.; Dow, W.P.-
2008Through-Hole Filling by Copper ElectroplatingDow, W.P.; 竇維平; Chen, H.H.; Yen, M.Y.; Chen, W.H.; Hsu, K.H.; Chuang, P.Y.; Ishizuka, H.; Sakagawa, N.; Kimizuka, R.-