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日期標題作者全文
三月-2012Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au ElectrodesChiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin; Wei-Chun Wang-
四月-2011Chemical Deposition of Ni/Pt Bi-Layer on Polyimide Film as Flexible Counterelectrodes for Dye-Sensitized Solar CellsCherng, Sheng-Jye; Chen, Chih-Ming; Dow, Wei-Ping; Lin, Ching-Hsuan; Chen, Sinn-Wen; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-
八月-2011Copper Underpotential Deposition on Gold in the Presence of Polyethylene Glycol and ChlorideChiu, Yong-Da; Dow, Wei-Ping; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin; Huang, Su-Mei; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
七月-2011Effects of supporting electrolytes on copper electroplating for filling through-holeChen, Chien-Hung; Lu, Chun-Wei; Huang, Su-Mei; Dow, Wei-Ping; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-
2012Electrodeposition of Copper on a Pt(111) Electrode in Sulfuric Acid Containing Poly(ethylene glycol) and Chloride Ions as Probed by in Situ STMFu, YunLin; Pao, Te; Chen, Sih-Zih; Yau, ShuehLin; Dow, Wei-Ping; Lee, Yuh-Lang; Wei-Chun Wang-
2011Highly Selective Cu Electrodeposition for Filling Through Silicon HolesDow, Wei-Ping; Lu, Chun-Wei; Lin, Jing-Yuan; Hsu, Fu-Chiang; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
2011In Situ Scanning Tunneling Microscopy Study of 3-Mercaptopropanesulfonate Adsorbed on Pt(111) and Electrodeposition of Copper in 0.1 M KClO4 þ 1 mM HCl (pH 3)Yen, Po-Yu; Tu, Hsin-Ling; Wu, Heng-Liang; Chen, Sihzih; Vogel, Walter; Yau, Shueh-Lin; Dow, Wei-Ping; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
2011In Situ STM Imaging of Bis-3-sodiumsulfopropyl-disulfide Molecules Adsorbed on Copper Film Electrodeposited on Pt(111) Single Crystal ElectrodeTu, Hsin-Ling; Yen, Po-Yu; Chen, Sihzih; Yau, Shueh-Lin; Dow, Wei-Ping; Lee, Yuh-Lang; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
2014Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding JointsLin, Chih-Fan; Chen, Chih-Ming; Dow, Wei-Ping; Liu, Hung-Hsin; Tien, Ho-Chun; Lee, Shih-Fu; Chen, Wei-Ming-
2011Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating SolutionsChiu, Yong-Da; Dow, Wei-Ping; Huang, Su-Mei; Yau, Shueh-Lin; Le, Yuh-Lang; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-
2011Through-Hole Filling by Copper Electroplating Using a Single Organic AdditiveDow, Wei-Ping; Liu, De-Huei; Lu, Chun-Wei; Chen, Chien-Hung; Yan, Jhih-Jyun; Huang, Su-Mei; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-