瀏覽 的方式: 作者 Huang, Su-Mei

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八月-2011Copper Underpotential Deposition on Gold in the Presence of Polyethylene Glycol and ChlorideChiu, Yong-Da; Dow, Wei-Ping; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin; Huang, Su-Mei; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
六月-2012Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating SolutionHuang, Su-Mei; Liu, Cheng-Wei; Dowc, Wei-Ping; Wei-Chun Wang-
七月-2011Effects of supporting electrolytes on copper electroplating for filling through-holeChen, Chien-Hung; Lu, Chun-Wei; Huang, Su-Mei; Dow, Wei-Ping; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-
2011Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating SolutionsChiu, Yong-Da; Dow, Wei-Ping; Huang, Su-Mei; Yau, Shueh-Lin; Le, Yuh-Lang; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-
2011Through-Hole Filling by Copper Electroplating Using a Single Organic AdditiveDow, Wei-Ping; Liu, De-Huei; Lu, Chun-Wei; Chen, Chien-Hung; Yan, Jhih-Jyun; Huang, Su-Mei; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-