Browsing by Author Wei-Ping Dow

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DateTitleAuthor(s)File
May-2013Accelerator Screening by Cyclic Voltammetry for Microvia Fillingby Copper Electroplating-
May-2013Characterization of Through-Hole Filling by CopperElectroplating Using a Tetrazolium Salt Inhibitor-
Jan-2013Copper seed layer repair using an electroplating process for through siliconvia metallization-
Jul-2013Effects of organic acids on through-hole fillingby copper electroplating-
2011Electroless Deposition of Barrier and Seed Layersof Through Silicon Via竇維平; Wei-Ping Dow; 周嘉珮; Chou, Chia-Pei; 中興大學-
25-May-2017Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder JointsHsuan Lee; Tai-Yi Yu; Hsi-Kuei Cheng; Kuo-Chio Liu; Po-Fan Chan; Wei-Ping Dow; 陳志銘; Chih-Ming Chen
Feb-2013Periodic Pulse Reverse Cu Plating for Through-Hole Filling-
Dec-2013Scanning Tunneling Microscopy of Superfilling in FormulaContaining Chloride, Polyethylene Glycol andBis-3-Sodiumsulfopropyl-Disulfide-
Aug-2013Silver Metallization of Polyimide Surfaces Using EnvironmentallyFriendly Reducing Agents
Sep-2013Through-Hole Filling in a Cu Plating Bath with FunctionalInsoluble Anodes and Acetic Acid as a Supporting Electrolyte-
Mar-2016Trap and release of bisphenol-A, 2-naphthol, and doxepin using a 1-hexadecylamine-copper(II)-amine functionalized indium-tin-oxide electrodeGuo-RongLin; JohnBiechele-Speziale; Elijah Ernst; Stuart Burris; Eric D.Conte; Wei-Ping Dow; Rong-Ho Lee; Shing-Yi Suen; 孫幸宜
Dec-2013Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate MicroviaFilling by Copper Electroplating-
2014以氧化鋅為中間層行玻璃表面金屬化竇維平; Wei-Ping Dow; Chi-Wen Cheng; 鄭家雯; 化學工程學系所
2014以石墨烯當導電層與阻障層用於矽通孔之電鍍填充竇維平; Wei-Ping Dow; Shih-Cheng Chang; 張世誠; 化學工程學系所
2011化學方法製備鎳奈米顆粒及無鈀中性無電鍍銅配方於軟性聚亞醯胺基板之金屬化研究陳信文; 李玉朗; 林智汶; 竇維平; Wei-Ping Dow; 黃上恩; Huang, Shang-En; 中興大學-
2010填充矽通孔之新穎電鍍銅配方姚學麟; Shueh-Lin Yau; 李玉郎; 胡啟章; Yuh-Lang Lee; Chi-Chang Hu; 竇維平; Wei-Ping Dow; 陳偉翔; Chen, Wei-Hsiang; 中興大學-
2012填充矽通孔之新穎電鍍鎳鎢合金配方竇維平; Wei-Ping Dow; 黃馨嫚; Huang, Hsin-Man; 化學工程學系所-
2012填充矽通孔之新穎電鍍鎳鎢合金配方竇維平; Wei-Ping Dow; 黃馨嫚; Huang, Hsin-Man; 化學工程學系所-
2013填充通孔之電鍍銅配方的開發竇維平; Wei-Ping Dow; 嚴之君; Yan, Jhih-Jyun; 化學工程學系所-
2013填充通孔之電鍍銅配方的開發竇維平; Wei-Ping Dow; 嚴之君; Yan, Jhih-Jyun; 化學工程學系所-