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三月-2012Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au ElectrodesChiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin; Wei-Chun Wang-
八月-2011Copper Underpotential Deposition on Gold in the Presence of Polyethylene Glycol and ChlorideChiu, Yong-Da; Dow, Wei-Ping; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin; Huang, Su-Mei; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
2011In Situ Scanning Tunneling Microscopy Study of 3-Mercaptopropanesulfonate Adsorbed on Pt(111) and Electrodeposition of Copper in 0.1 M KClO4 þ 1 mM HCl (pH 3)Yen, Po-Yu; Tu, Hsin-Ling; Wu, Heng-Liang; Chen, Sihzih; Vogel, Walter; Yau, Shueh-Lin; Dow, Wei-Ping; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
2011In Situ STM Imaging of Bis-3-sodiumsulfopropyl-disulfide Molecules Adsorbed on Copper Film Electrodeposited on Pt(111) Single Crystal ElectrodeTu, Hsin-Ling; Yen, Po-Yu; Chen, Sihzih; Yau, Shueh-Lin; Dow, Wei-Ping; Lee, Yuh-Lang; 國立中興大學化學工程學系; National Chung Hsing University,Department of Chemical Engineering; Miao-zhen Luo-
2011Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating SolutionsChiu, Yong-Da; Dow, Wei-Ping; Huang, Su-Mei; Yau, Shueh-Lin; Le, Yuh-Lang; National Chung Hsing University,Department of Chemical Engineering; 國立中興大學化學工程學系; Miao-zhen Luo-