Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/10513
標題: A study on electric conductivity of a conductive paint with silver-coated copper flakes in epoxy and the paint on carbon fiber reinforced plastic surface for copper electroplating in copper sulfate bath
碳纖維複合材料表面噴塗片狀鍍銀銅粉/環氧樹脂導電塗料之導電性及其硫酸銅浴電鍍特性研究
作者: 洪祥鑫
Hung, Hsiang-Hsin
關鍵字: 碳纖維複合材料
carbon fiber reinforced plastic
鍍銀銅粉
導電漆
鍍銅
silver-coated copper flakes
conductive paint
electroplating copper
出版社: 材料科學與工程學系所
引用: 1. 稻垣道夫 大谷杉郎 大谷朝男共著 賴耿陽譯著 “碳材料碳纖維工學” 2. 郭文雄 “複合材料零組件” http://www.aero.fcu.edu.tw/media/index.htm 3. 吳文演 “碳素纖維之研製與應用” http://ttf.textiles.org.tw/Textile/TTFroot/aa02n.htm 紡拓會全球資訊網 4. 林伯實 等… “複合材料產業技術手冊” 5. 吳泉源 “奠定複材製造王國的領航者:台灣網球拍產業發展史回顧” 6. 吳泉源 “台灣網球拍工業發展史口述歷史研究報告_精簡版” 7. Characteristics and applications of Pitch-base carbon rollers Akihiko/Composite material Div. Mitsubishi chemical function products, inc Paper , Film & Foil Covertech Pacific july,2001 pp.38-40 8. Mitsubishi chemical function products, inc “Technical information of Dialead composite roller” 9. R. W. Lang et al., Angew, Makromol. Chem., 146-147 (1986) pp. 267-321 10. 姜曉霞, 沈偉, "化學鍍理論及實踐", pp.195, 國防工業, (2000) 11. M. Menningen, H. Weiss, U. Fischer “Metallic wear resistant coatings for carbon fibre epoxy composite rolls” Surface and Coatings Technology 71 (1995) 208-214 12. L.M. Weisenberger and B.J. Durkin, “Copper Plating” ASM Handbook vol.9 pp.167-176 13. 蔡科然 “用於機械上的碳纖維滾筒之製造方法” I301447 中華民國專利 14. Mitsubishi Kasei Corporation catalog “CFRP Industrial composite roll” 15. 邱長塤、徐國倫 “複合材料化學鍍銅之研究” 逢甲大學紡織工程研究所碩士論文(2002) 16. 黃肇瑞、陳韋伶 “表面鍍銅改良碳纖維/環氧樹脂熱傳導性質之研究” 成功大學材料科學及工程學系碩士論文(2003) 17. 楊德安、宋建靜 “PEEK/CF複合材料鍍金屬工藝研究” 天津大學材料學院碩士論文(2005) 18. 王大倫 “實用電鍍學” pp.197-234 19. 張允誠 胡如南 向榮 “電鍍手冊” 20. 蘇葵陽編譯 張良謙校正 “實用電鍍理論與實際” 21. F. A. lowenheim, “Electroplating”, McGraw-Hill, New York, pp.113~166, 1978. 22. M. Paunovic and M. Schlesinger, “Fundamental of Electrochemical Deposition”, John Wiley & Sons, Inc, New York, pp. 197~208, 1998. 23. Winand, R., ‘Application of Polarization Measurements in the Control of Metal Deposition’ (Edited by I. H. Warren), p. 47 24. Franklin, T. C., Surface and Coatings Technology 30, 415(1987). 25. Winand R. , Hydrometallurgy, 29, 567-598(1992). 26. 劉顯榮, ”鍍銅陽極面面觀” 電路板資訊, 41,63-73,(1991). 27. 友野理平/歐靜枝/賴耿陽/劉一守 塑膠金屬化加工技術 28. 李守誠 ABS 塑膠電鍍技術 華聯出版,(1973)。 29. 王平 郭洪猷“導電塗料( I ) ” 現代塗料與塗裝, vol.2 , 1997 30. 王平 郭洪猷“導電塗料( II ) ” 現代塗料與塗裝, vol.3 , 1997 31. 張雄偉 黃銳 高分子複合導電材料及其應用發展趨勢. 功能材料, 2004, 3:1-5. 32. 蔡蘊明 譯, The 2000 Nobel Prize in Chemistry, The Royal Swedish Academy Of Sciences, October 10, 2000, http://nobelprize.org/nobel_prizes/chemistry/laureates/2000/public.html http://gchem.ac.nctu.edu.tw/nobel/nobel_2000.htm 33. 錢逢麟 竺玉書, 塗料助劑-品種和性能手冊, 北京:化學工業出版社, (1990) 34. 于晓輝, 導電塗料的研製開發與應用,昆民理工大學碩士論文, 2005 35. 林碩 李志章 吳年強等, 導磁屏蔽導電複合塗料, 材料導報, 1996(3):72-76 36. 林碩 吳年強 李志章, 偶聯劑對銅系復合涂料導電穩定性的影響, 複合材料學報, 1999(4):44-49 37. 日本專利公開, 昭48-27987 38. R.D.Sherman, L.M.Middleman, S.M.Jacobs, Polymer Engineering and Science, Tan. 1983, vol 23, No.1, 36 39. Vanbeek L. R. H. et al. , J. Appl. Polym. Sci., 1962I, 6(24):651. 40. Miyauchi S. et al. , J. Appl. Polym. Sci., 1985:30(7):2753. 41. Polley M. H. et al. . Rubb. Chem. Techn01. ,1957;30(1):170 42. Abdel-Bary E. M. et al. ,J. Polym. Chem. Ed. ,1979;17(7):2163 43. 呂仙月, 導電塗料的導電機理, 華北工學院學報. 1998, 19(4):329-332
摘要: The study used different weight percent conductive paint with silver-coated copper flakes in epoxy on carbon fiber reinforced plastic surface , employ the electric conductivity of paint for copper electroplating in copper sulfate bath to avoid the complex processes and surface defects of electro-less plating on carbon fiber reinforced plastic surface. The result of the experiment , the electric resistance of carbon fiber reinforced plastic tube surface is about 1.279x10-3Ω.㎝ 2 , it can’t plated copper with copper sulfate bath. There is not having continuous electric conduction net and complete electroplate layer of conductive paint while the silver-coated copper flakes less than 20 weight percent in epoxy. There is complete electroplate layer of the conductive paint while the silver-coated copper flakes more than 30 weight percent in epoxy. The electric resistance of conductive paint while the silver-coated copper flakes more than 40 weight percent in epoxy is 10-5Ω.㎝ 2. There is lower electric resistance(70%、1.265 x10-5Ω.㎝ 2),smooth electroplate surface and better combine while the conductive paint having higher weight percent of silver-coated copper flakes in epoxy. The conductive paint of 50 weight percent silver-coated copper flakes in epoxy had better cathode efficiency. The copper electrodeposited on electrics discharge point of conductive paint coated surface while the conductive paint had not enough of electric conduction net. The electroplate layer was fine island crystal and transverse growth by leveling effect. The electric discharge point is uniform distributed over conductive paint while the conductive paint had enough electric conduction net. The copper uniform electrodeposited fine particle or branch crystal on conductive paint surface. The electroplate layer was full covered with conductive paint surface and vertical growth of substructure. The XRD of copper electroplated on conductive paint surface was 100(43.22°)、34(50.32°)、18(74.07°).
本實驗以不同比例片狀鍍銀銅粉/環氧樹脂混合成導電塗料,噴塗於碳 纖維複合材料表面,藉由導電塗料的導電性施行硫酸銅浴鍍銅,以避免傳 統碳纖維複合材料表面化學鍍銅的繁複流程及缺陷。 實驗結果顯示,碳纖維/環氧樹脂複合材料圓管表面電阻值約1.279x10-3 Ω.㎝ 2,無法以硫酸銅鍍浴進行直接電鍍,導電漆鍍銀銅粉含量低於20%不 具有連續導電通路,電鍍後鍍層無法完整批覆導電漆表面;含30%鍍銀銅 粉導電漆表面可形成完整鍍層批覆,40%以上銀銅粉導電漆電阻值可達10 -5 Ω‧cm2,銀銅粉含量越高,電阻值越低(70%、1.265 x10 -5 Ω‧cm2),鍍層平 整性越佳,結合性越好(4.97 Mpa), 50%鍍銀銅粉導電漆鍍銅具有最佳陰極 效率92.9%。 當導電通路不足時,電沉積銅在導電漆表面,放電點處成核,受整平 效應影響形成島型細顆粒狀結晶,鍍層朝橫向成長;若導電通路完整時, 放電點完整覆蓋導電漆表面,電沉積銅在導電漆表面均勻成核形成群聚細 顆粒狀或樹枝狀晶體,鍍層完全批覆導電漆表面,鍍層朝垂直基材方向成 長;導電漆表面鍍銅層XRD 分析結果為100(43.22˚)、34(50.32˚)、18(74.07˚)。
URI: http://hdl.handle.net/11455/10513
其他識別: U0005-2108200716430600
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-2108200716430600
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