Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/11128
標題: 可撓式LED光板之製程研發與特性研究
Fabrication and Characterization of Flexible LED Optical Plates
作者: 陳文雋
Chen, Wen-Chun
關鍵字: 可撓式
Flexible
背光源
發光二極體
Backlight
LED
出版社: 材料工程學系所
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摘要: 軟性電子是一種將元件與材料技術建置在可彎曲的基板上的新興科技,近年來已成為科技熱門話題。目前眾多新穎技術當中僅少數有應用產品推出,在於許多關鍵技術尚未有所突破,其中可撓式背光源便是一個例子。本論文的的核心技術就是在開發一輕、薄並可撓曲的發光板。 吾人於論文中提出關鍵製程,結合高反射率金屬電極將發光二極體陣列在以玻璃為承載基板的可撓性銦錫氧化物透明導電基板上,開發穩定且高壽命的固態光源。製程建立在薄膜技術以及現今半導體製程,且為達降低微影的成本,製程中不使用光罩。在彎曲實驗中,測試不同彎曲半徑對銦錫氧化物基板的影響;結果發現使用250 oC製程的二氧化矽做為阻障層,其基板結構具有最佳的機械特性。垂直導通式發光二極體做為固態光源,並陣列在銦錫氧化物薄膜以及鋁薄膜之間;跟一般封裝後的發光二極體不同的是製程直接使垂直導通發光二極體晶粒,兼具低成本、環保且更長的使用壽命。 再者,將整個可撓式光板彎曲做測試,仍展現其發光的特性。在於基板厚度控制整個結構的應力,使光板可以彎曲到很小的曲率半徑。因此我們可以說,可撓式發光二極體光板的首例讓我們向可撓式液晶顯示器邁進一大步。
Electronic devices fabricated on flexible substrate are the object of rapidly growing interest of research community and industry. Based on several novel technologies, a limited number of products are already being produced. However, like many new technologies of the future, some technical issues have to be resolved such as flexible backlight source. The focus of this paper is to develop a thin, flexible and light emissive sheet. This thesis reports on a scalable manufacturing process for fabricating LED-based light sheet by bonding a grid of LED chips on a conductive flexible ITO substrate carried by a glass plate and combining a reflective metal electrode to produce long lasting and durable solid-state lighting sources. The process sequence is based on thin film technology compatible with existing manufacturing process. In order to achieve significant savings over conventional photolithography, our fabrication process is mask-less. Bending experiments were performed for different ITO structure as a function of radius. The ITO film with SiO2 buffer layer for transparent conductors is the most mechanically robust structure fabricated at 250 C. The vertical-LEDs chips were used as solid-state light source and the LEDs were arrayed between ITO and Al thin films. Avoiding the use of conventionally packaged LED, the vertical-LEDs chips can achieve cost saving, environmentally-friendly and long lifetimes. Furthermore, the bending tests have been also applied to flexible light sheet. Bending test on these light sheet shows that their light performance is not change. Because we can control the stress of structure by different substrate thickness, such light sheets function can be well after the substrate bend to small radii of curvature. The first demonstration of flexible light sheet is a very promising approach to flexible displays.
URI: http://hdl.handle.net/11455/11128
Appears in Collections:材料科學與工程學系

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