Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/11521
標題: 阻氣性鍍膜應力緩衝層之製作與特性研究
Fabrication and Characterization of Stress-Relief Layers for Gas Barrier Coatings
作者: 王詠聖
Wang, Yung-Sheng
關鍵字: 阻氣性鍍膜
Barrier layer coatings
氮化矽
氧化矽
電漿輔助化學氣相沉積系統
紫外光固化高分子
水氣穿透率
Silicon nitride
Silicon oxide
PECVD
UV curing polymer
WVTR
出版社: 材料科學與工程學系所
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摘要: 具薄型化與耐撓曲特性之有機發光二極體的開發是近期之趨勢,其中有機發光二極體元件中之發光層對於水/氧氣相當敏感,因此有機發光二極體元件的封裝至為重要。薄膜型的封裝方法被認為是可行且有發展性的技術,其運用無機材料做為多層堆疊結構使得各層之間的缺陷交互錯開,使得水氣的穿透率達最小化;而有機材料因本身為長鏈狀結構,故對於阻擋水氣穿透並無明顯效果,多半應用於應力緩衝及封裝結構保護之用。本論文運用電漿輔助化學氣相沉積系統與紫外線光固化系統製作氮化矽及氧化矽與光固化高分子,實驗分別探討不同製程參數對於氮化矽及氧化矽薄膜特性之影響。其次製作多疊層薄膜封裝結構,利用鍍鈣測試法量測封裝結構之水氣穿透率,並探討高分子緩衝層厚度的改變對於整體封裝結構之水氣穿透率、表面粗糙度、可見光穿透率等變化。經過研究設計優化後的封裝結構,其水氣穿透率可達1.28×10-7 g/m2/day (60 ℃,相對溼度90 %,測試時間為一千兩百小時)、表面粗糙度僅0.198 nm、可見光穿透率達90 %以上。結果驗證了導入可調變應力之封裝結構並應用於薄型化的有機發光二極體元件上將有其發展潛力。
Recent technical developments have succeeded in promoting the thinness and flexibility of organic light emitting diodes (OLED); however, OLED devices are readily susceptible to the moisture and oxygen. This has led to new challenges in device packaging. Using thin films for packaging is regarded as a feasible method with considerable potential. Multi-layer stack structures comprising inorganic materials stagger the pinholes and micro-defects between layers, thereby minimizing penetration of moisture. Organic materials form long-chain structures that are less effective against moisture; therefore, we employed these materials as a stress-relief layer to prevent the structure of the packaging which destroys by internal stress. This thesis employed a plasma-enhanced chemical vapor deposition (PECVD) system in conjunction with UV light curing equipment to fabricate silicon nitride (SiNx), silicon oxide (SiOx) and a UV light curing polymer. At the beginning, extensive parameters studies of the dependence on respective silicon nitride and silicon oxide growth are considered to be done to develop an optimal condition or recipe for the barrier growth. After obtaining suitable parameters, various pairs of multilayer stacks containing silicon oxide and silicon oxide are prepared to discuss the transmission rates of water vapor and fracture toughness. We also determined how the thickness of the UV light curing polymer layer influences the surface roughness, visible light transmittance, and water vapor transmission rate (WVTR) of the overall packaging structure. Within the optimized barrier structure, the WVTR reached 1.28�10-7 g/m2/day (60 �C and 90 % RH during 1200 hours). The low internal stress stack structure exhibited surface roughness of 0.198 nm and visible light transmittance above 90 %. These results demonstrate the potential and effectiveness of applying stress adjusted packaging structures to OLED devices.
URI: http://hdl.handle.net/11455/11521
其他識別: U0005-2908201210432400
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-2908201210432400
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