Please use this identifier to cite or link to this item:
AN EXPERIMENT INVESTIGATION ON THE EFFECTS OF CHEMICAL REACTION AND MECHANICAL POLISHING IN CHEMICAL-MECHANICAL POLISHING OF WAFERS WITH COPPER FILM
abrasive-free polishing (AFP)
Chemical mechanical polishing (CMP) is the most commonly used process in the planarization of wafer surface. This thesis investigates the effect of chemical reactions and mechanical wears on the removal rate and polishing quality in CMP of wafers with copper film. Five types of experiments, including chemical corrosion, mechanical polishing (MP), polishing with DI water, abrasive-free polishing (AFP), and CMP, are designed and conducted with different chemical additives and polishing forces in this research. Al2O3 and diluted HNO3 are used as abrasives and solvent in these experiments. Material removal rate (RR) and surface roughness (SR) of wafers are measured as indices. The results of experiment indicate: (1) RR differs a lot among different experiments. RR increases to a great amount when chemical reaction combined with mechanical polishing that indicates RR is not a simple superposition of chemical reaction and mechanical polishing. (2) RR of experiment with Citric Acid as additive is higher than that of experiments with benzotriazole (BTA) as additive. Surface roughness (SR) of the former, however, is worse than that of the later. It indicates that Citric Acid has lower capability to restrain chemical reactions. (3) RR of CMP experiment is the highest while RRs of polishing experiment with DI water and chemical corrosion are much lower. (4) SR of AFP is the best while CMP experiment with Citric Acid makes the worst surface. (5) Although RR data are not as expected by abrasive-based polishing model, the change rate of RR with different polishing pressures in MP experiments is consistent with the model. While RR exists in polishing experiments with DI water showed that the fluid-based polishing model does not fit well and needs further investigation.
|Appears in Collections:||機械工程學系所|
Show full item record
TAIR Related Article
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.