請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/3102
標題: 有機硫化物修飾銅、金電極之研究及其在電鍍銅上的應用
Studies of Organosulfides-modified Cu and Au Electrodes and Their Applications on Cu Electrodeposition
作者: 邱詠達
Chiu, Yong-Da
關鍵字: 有機硫化物修飾銅
Organosulfides-modified Cu
金電極
電鍍銅
Au Electrodes
Cu Electrodeposition
出版社: 化學工程學系所
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摘要: 本實驗著重有機硫化分子在電鍍銅上的研究與應用。利用分子自組裝的方法修飾黃金基材,並搭配線性掃描沉積合成出奈米雙晶銅牆,其中包含針對鍍液組成與電鍍參數對整個製程的影響做研究,以釐清造成此奈米雙晶銅牆的主要成因,並詳細探討其生成機制。實驗發現電鍍液組成在硫酸系統下搭配有機硫化分子3-Mercaptopropionic acid (MPA) 對黃金基材進行表面改質,所得到的雙晶銅牆良率最高,此外本實驗另一個特色就是不需要使用任何模組就可以合成出有方向性的奈米雙晶銅牆陣列,主要是黃金基材在進行分子自組裝前會先經過氫焰鍛燒,推測應該是黃金基材在氫焰鍛燒過程中,金原子進行規律的重排所致。 但是如果省略了分子自組裝的動作,發現只利用調控掃描的終端電位在kinetic control的範圍內,不添加任何電鍍添加劑下,也能合成出有方向性的金字塔形狀銅金屬顆粒,其金屬顆粒成長的方向跟底部黃金基材不同的晶面有關,最後也探討鍍銅常見的光澤劑SPS在電鍍過程中轉置的機制,且更進一步利用其分析手法開發出新穎的盲孔填充光澤劑3,3-thiobis(1-propanesulfonic acid, sodium salt) (TBPS)。
In this thesis, we focused on the studies of organosulfides and their applications on Cu electrodeposition. The basic concept of the research is based on self-assembled monolayers (SAMs) of organosulfides, using it to modify Au electrode surface and combined with linear sweep voltammetry (LSV) to synthesize nano twinned copper (nt-Cu) wall. Meanwhile, we investigated the effects of the compositions of electrolyte and electroplating parameters to clarify the formation mechanism of nt-Cu wall. We found that when the electrolyte contained sulfuric acid and the Au electrode surface was modified by 3-Mercaptopropionic acid (MPA), nt-Cu walls with a good yield could be obtained without using a template. Highly regular array of nt-Cu walls can be achieved after the Au electrode surface was annealed by hydrogen flame before Au electrode surface modification. Oriented pyramid-like Cu particles could be synthesized on the non-modified Au electrode surface without adding any additives in the copper plating solution but only controlling the terminal potential of LSV within kinetics-controlled regime. The growth direction of pyramid-like Cu particle was related to different facet of the Au electrode substrate. Finally, we also studied the transferable mechanism of the well-known brightener, SPS, during the plating process, and further used its analytic method to screen for an novel brightener, 3,3-thiobis(1-propanesulfonic acid, sodium salt) (TBPS) for microvia filling of a printed circuit board (PCB).
URI: http://hdl.handle.net/11455/3102
其他識別: U0005-0307201314551700
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-0307201314551700
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