Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/34455
標題: Architectural Growth of Cu Nanoparticles Through Electrodeposition
作者: Ko, W.Y.
林寬鋸
Chen, W.H.
Cheng, C.Y.
Lin, K.J.
關鍵字: Copper
Shape control
Electrochemistry
Nanostructure
Nanoparticles
shape-controlled synthesis
platinum nanoparticles
copper
nanoparticles
gold nanocrystals
silver
nanoprisms
nanowires
mechanism
crystals
期刊/報告no:: Nanoscale Research Letters, Volume 4, Issue 12, Page(s) 1481-1485.
摘要: Cu particles with different architectures such as pyramid, cube, and multipod have been successfully fabricated on the surface of Au films, which is the polycrystalline Au substrate with (111) domains, using the electrodeposition technique in the presence of the surface-capping reagents of dodecylbenzene sulfonic acid and poly(vinylpyrrolidone). Further, the growth evolution of pyramidal Cu nanoparticles was observed for the first time. We believe that our method might open new possibilities for fabricating nanomaterials of non-noble transition metals with various novel architectures, which can then potentially be utilized in applications such as biosensors, catalysis, photovoltaic cells, and electronic nanodevices.
URI: http://hdl.handle.net/11455/34455
ISSN: 1931-7573
文章連結: http://dx.doi.org/10.1007/s11671-009-9424-5
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