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標題: 化學添加劑對於化學方法製備銅奈米顆粒及銅薄膜於聚亞醯胺上之特性研究
Studies of Chemical Additives on Chemical Formation and Characterization of Cu Nanoparticles and Cu thin film on Polyimide
作者: 廖國良
Liao, Guo-Liang
關鍵字: Polyimide (PI)
Wet process
Electroless Copper Deposition
chemical additives
出版社: 化學工程學系所
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摘要: 近年來,隨著電子產品朝向高性能、多功能、小型化、薄型化、攜帶型化等的方向發展,傳統的硬性印刷電路板已經面臨淘汰或與軟性印刷電路板結合的命運。而軟性基材上的目前所遭遇的問題即是佈線接著性的金屬化問題。因為常使用的導線材質為銅金屬,要如何在不導電的聚亞醯胺基材上製作出微米線路,而不會出現銅膜與聚亞醯胺基材的附著力不佳及鬆散的金屬結構等問題,為目前軟性印刷電路板待克服的問題。 本研究利用全濕式的化學法,於聚亞醯胺基材上進行直接表面金屬化,使銅奈米顆粒沉積於聚亞醯胺表面上;再以此銅奈米層為晶種層,進行無電電鍍銅使銅層增厚平坦化。根據實驗結果,經由二甲基胺硼烷還原出的銅奈米顆粒的催化活性並不佳,因此吾人藉由電鍍中所使用的化學添加劑,將添加劑加入還原劑中,使銅奈米顆粒於還原過程中被修飾,銅顆粒大小變得較小且均一,後續無電鍍銅的沉積速率也因而提升,於附著性與導電性測試皆良好;由此可知,這些化學添加劑於化學修飾的聚亞醯胺上,對奈米金屬顆粒的生成具有相當大的影響。上述之系列樣品將以衰減式全反射傅立葉紅外光譜儀分析表面的化學變化,原子力顯微鏡分析銅奈米顆粒還原前後的表面型態變化,場發射掃描式電子顯微鏡分析銅奈米顆粒於聚亞醯胺表面的型態,穿透式電子顯微鏡分析試片截面的金屬分佈型態,能量散佈光譜儀分析表面元素,進而研究其後續應用與開發。
其他識別: U0005-2207200916175000
Appears in Collections:化學工程學系所



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