Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/3813
標題: 合成含亞醯胺之ABB’分歧狀多胺中間體應用於難燃型環氧樹脂之製備
Synthesis of Imide Containing ABB' Dendritic Polyamine Intermediates as Flame Retardant for Epoxy Resins
作者: 林長佑
Lin, Chang-Yu
關鍵字: Hyperbranched Polymer
分歧狀高分子
Epoxy
Imide
phosphorous
Curing agent
環氧樹脂
亞醯胺

硬化劑
出版社: 化學工程學系所
引用: 1. L. Chen and Y. Z. Wang, Polym. Adv. Technol., 2010, 21, 1–26, 2. R. C. Hale, M. J. Laguardia, E. P. Harvey, T. Mattesonmainor, W. H. Duff and M. O. Gaylor, Environ. Sci. Tech., 2001,35 3. World Health Organization, Brominated Diphenyl Ethers (Environmental Health Criteria , No 162) 4. 歐盟法規資料庫http://europa.eu/old-address.htm 5. 國際電工委員會,EC 61249-2-21 (2003-11) Ed. 1.0 Bilingual International Electrotechnical Commission (IEC) 6. Japan Electronics Packaging and circuits association JPCA-ES02-2007 ~ JPCA-ES06-2007, ,Book S002 http://www.jpca.net/jp/e/standards.html 7. De Trey , Switzerland Patent, No.: CH 211,116, issued to De Trey, on Nov. 18, 1940 and titled "Verfahren zur Herstellung eines Hartbaren Kunstharzes." 8. 王春山,化工技術,第二卷第十期,P55,1994 9. K. P. Richard,“Engineering Plastics”, ASM International 1998, 240. 10. 賴耿陽,環氧樹脂應用實務,復漢出版 11. 賴家聲,環氧樹脂與硬化劑(上)(下),高分子工業, 83期,P67-71, 84期,P47-51 12. 胡志明, 鍾松政, 奈米科技專刊, 2002, 197. 13. H. Lee and K. Neville, “Handbook of Epoxy Resins”, McGraw-Hill, New York, 1967. 14. C. A. May, Y. Tanaka , ”Epoxy Resins”, Marcel Dekker, New York, 1973. 15. C. P. Wang, Polymer for Electric and Photonic Application, Princeton. New Jersey, 1993. 16. Bogert, T. M.; Renshaw, R. R., J. Am. Chem. Soc., 1908, 30, 1140 17. Edwards, W. M., Brit. Pat., 1959, 651 18. 馬振基, 塑膠資訊, 1997, 7. 19. M. K. Ghosh and K. L. Mittal, “Fundamentals and Applications”,Marcel Dekker, 1996. ,1~6 20. T. Kaneda, M. Horio, T. Katsura, H. Makino and K. Nakagawa, J. Appl. Polym. Sci., 1986, 32, 3133. 21. M. Oba, J. Polym. Sci. A: Polym. Chem., 1996, 34, 651. 22. N. A. Adrova, M. I. Bessonov, L. A. Laius and A. P. Rudakov, “Polyimides: A new class of thermally stable polymers (in Russian)” , Nauka, Leningrad, 1968. 23. P. M. Hergenrother, J. Appl. Polym. Sci., 1974, 18, 1779. 24. C. P. Yang and S. H. Hsiao. J. Appl. Polym. Sci., 1985, 30, 2883. 25. M. L. Bender, Y. L. Chow and F. Chloupek, J. Am. Chem. Soc., 1958, 80, 5380. 26. R. A. Dine-Hart and W. W. Wright, J. Appl. Polym. Sci., 1967, 11, 609. 27. J. A. Kreuz, J. Polym. Sci. Part A: Polym. Chem., 1990, 28, 3787. 28. R. J. W. Reynold and J. d. Saddon, J. Polym. Sci. Part C: Polymer Symposia, 1968, 23, 45. 29. 沈永清, 張信貞, 莊學平, 張榮樹, 化工資訊, 1995, 第九卷, 第二期, 1~31. 30. D. W. van Krevelen, Polymer, 1975, 16, 615 31. K. L. Wang, M. Jikei and M. Kakimoto, J.Polym.Sci.Part A: Polym.Chem., 2004, 42, 3200 32. K. C. Cheng, Polymer, 2003, 44, 1259. 33. K. C. Cheng, T. M. Don, W. J. Guo and T. H. Chuang, Polymer, 2002, 43, 6315 34. S. Nasar, M. Jikei and M. Kakimoto, European Polymer Journal, 2003, 1201. 35. Y. Kim, J.Polym.Sci.Part A: Polym.Chem., 1998, 36, 1685. 36. S. S. Mahapatra and N. Karak, Materials Chemistry and Physics, 2008, 112, 1114. 37. S. S. Mahapatra and N. Karak, Journal of Macromolecular Science, Part A: Pure and Applied Chemistry , 2009, 46, 296. 38. H. J. Leary Jr and D. S. Campbell, Surface and Interface Analysis, 1979, 1, 75. 39. H. Chen and J. Yin, J.Polym.Sci.Part A: Polym.Chem., 2004, 42, 1735. 40. 薛志彬, 中興大學化工系碩士論文, 2007 41. N. Yamazaki, M. Matsumoto and F. Higashi, J.Polym.Sci : Polym.Chem., 1975, 13, 1373 42. N. Ogata and H. Tanaka, Polym. J, 1971, 2, 672 43. G. Yang, M. Jikei and M. Kakimoto, Macromolecules, 1998, 31, 5964 44. 施君儒, 中興大學化工系碩士論文, 2008
摘要: 本研究以薛志彬碩士論文作為基礎,利用3,4-dimethylbenzene及1-chloro,2,4-dinitrobenzene成功製備出含ABB’型二苯醚中間體(DAPPAcE),經放大製程,可以成功將overall yield提升至87%,再進一步經由分子結構設計,與商業品胺類如Aniline、m-phenylene diamine、Tris(4-aminophenyl)thiophosphate結合,進而合成含亞醯胺多胺化合物,皆有77%以上的overall yield,並作為交聯劑應用於高性能環氧樹脂之合成,能充分提升其機械性質、熱性質及耐燃性質。 藉由所製備ABB’分歧狀中間體,本研究進行四組比較:(1)Di-Amino Imide (2)Tetra-Amino Imide (3)Hexa-Amino Imide (4)Hyperbranched Polyamine,添加此四種多胺以不同比例與BE188 / 4,4′-Diaminodiphenylmethane (DDM) / DMAc進行反應,合成出具耐熱性質及難燃性質之環氧樹脂。在熱性質中熱裂解溫度最佳的為摻入Polyamine 3%,環氧樹脂之Td可從287℃大幅提升至396℃,Tg則是摻入Hexa-Amino Imide 40%較為優良,DSC測量之Tg可從124℃提升至178℃、DMA測量之Tg可從115℃提升至181℃,且在耐燃性質有不錯的表現char yield有35%且預測之LOI也達到32。另外在機械性質上,以DMA 50℃下檢測之儲存模數 (E’) 作為比較,摻入Polyamine 1%之儲存模數最高,可從11提升至21 GPa。 從大比例到小比例添加,可以看出在官能基數目越高,其添加量就不能太高,會導致材料因為過度交聯而性質弱化,從添加Polyamine系統中,可以看出添加量越大,其材料碎裂程度越高,材料之熱性質也會不佳,但在小量添加下,可以有大幅度的熱性質機械性質提升。另外在Hexa-Amino Imide系統中看出,亞醯胺官能機對熱性質的提升,以及磷、硫官能基對難燃性質的強化。
URI: http://hdl.handle.net/11455/3813
其他識別: U0005-1708201009081500
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-1708201009081500
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