Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/3825
標題: 功能性硫醇分子在金(111)電極上的自組裝行為及對電鍍銅的影響
Self-Assembled Behavior of Functionalized Alkanethiols on Au(111) and Their Effects on Copper Electrodeposition
作者: 蘇敬文
Su, Jing-Wen
關鍵字: Self-assembled monolayer
自組裝單分子膜
cyclic voltammetry
underpotential deposition
overpotential deposition
循環伏安法
低電位沉積
過電位沉積
出版社: 化學工程學系所
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摘要: 自組裝單分子膜(Self-assembled monolayer, SAM)源於對材料表面的修飾,SAM能夠改變材料表面特性。在工業電鍍銅中,硫醇分子必須結合氯離子才會產生加速銅沉積的作用,而氯離子與硫醇會在銅沉積上產生交互作用,導致銅易於沉積在基材上。此論文將針對不同末端官能基硫醇修飾在金(111)上探討其電化學性質。 本實驗藉由循環伏安法(cyclic voltammetry, CV)來分析不同末端官能基硫醇(HS-C-COONa(MAA), HS-C-C-NH2(CYS), HS-C-C-C-SO3Na(MPS), (S-C-C-C-SO3Na)2(SPS), HS-C-C-C-OH(MPE)),於金(111)電極表面檢測單分子膜的特性。觀察硫醇分子浸泡於超純水或硫酸水溶液中進行自組裝時的穩定性,利用CV分析在還原脫附過程中不同硫醇的吸附強弱;在超純水中進行自組裝時MPE>CYS>MAA>MPS>SPS,而在硫酸水溶液下進行自組裝其吸附力為MPE=MPS>SPS>MAA>CYS。 利用X光光電子能譜儀(X-ray Photoelectron Spectrometer, XPS)與循環伏安法(CV)觀察不同末端官能基硫醇修飾於金電極表面捕捉銅離子能力,發現隨著不同官能基,其拉電子能力以及吸附在電極上覆蓋率的不同,因而影響銅離子的捕捉。由CV可得知硫醇分子對銅離子捕捉能力是MAA>MPS>CYS>MPE。 藉由循環伏安法(CV)觀察有機分子修飾於金(111)電極上電化學鍍銅行為,發現將銅電鍍於MAA、MPS或SPS有機吸附層上,分子本身具有捕捉銅離子能力,導致在低電位沉積時加速銅沉積,但在過電位沉積時只有MAA分子產生加速銅沉積的作用。而系統中添加氯離子時,金(111)表面修飾MAA、MPS與SPS,皆會在過電位沉積產生加速銅沉積的效果,CYS與MPE則在表面中形成阻障層抑制銅沉積。
Self-assembled monolayers can modify material surfaces and change characteristics of material surfaces. In copper electrodeposition, thiol molecules must combine with chloride ions for acceleration of Cu electrodeposition, and chloride ions interact with thiol during deposition to make copper ions be easily deposited on substrate. This thesis focuses on self-assembled behavior of functionalized alkanethiols on Au (111) and their effects on copper electrodeposition. This experiment analyzes characteristics of thiol molecules (MAA, CYS, MPS, SPS, MPE) on Au(111) electrode surface by cyclic voltammetry. Using CV to observe stability of thiol SAM in DI water and sulfuric acid, and to analyze adsorbability of these thiol molecules. The adsorbability of these thiol molecules which are self-assembled in DI water is MPE>CYS>MAA>MPS>SPS, and that in sulfuric acid is MPE=MPS>SPS>MAA>CYS. The capability of catching copper ions by the end-group of thiol molecules was characterized by X-ray Photoelectron Spectrometer and CV. Different end-group of the thiol molecules exhibits different capability for catching copper ions and also influence their surface coverage on Au(111). From CV we can realize that the capability of the end-group for catching copper ions is MAA>MPS>CYS>MPE. Through CV to observe copper electrodeposition on thiol-modified Au(111), we find that while copper was electrodeposited on MAA, MPS or SPS, the thiol has ability to catch copper ion which results in accelerating copper deposition during underpotential deposition, but only MAA molecules accelerate overpotential position of copper. While MAA, MPS or SPS modify Au(111) in the system with chloride, copper electrodeposition was accelerated in overpotential deposition, and CYS and MPE formed a barrier layer on Au(111) surfaces to suppress copper deposition.
URI: http://hdl.handle.net/11455/3825
其他識別: U0005-1907201020221100
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