Please use this identifier to cite or link to this item:
http://hdl.handle.net/11455/39947
DC Field | Value | Language |
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dc.contributor.author | Lee, M.H. | en_US |
dc.contributor.author | 張書通 | zh_TW |
dc.contributor.author | Chang, S.T. | en_US |
dc.contributor.author | Peng, C.Y. | en_US |
dc.contributor.author | Hsieh, B.F. | en_US |
dc.contributor.author | Maikap, S. | en_US |
dc.contributor.author | Liao, S.H. | en_US |
dc.date | 2008 | zh_TW |
dc.date.accessioned | 2014-06-06T08:02:55Z | - |
dc.date.available | 2014-06-06T08:02:55Z | - |
dc.identifier.issn | 0040-6090 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11455/39947 | - |
dc.description.abstract | The strained-Si:C long channel MOSFET on a relaxed SiGe buffer is demonstrated in this study. The extracted electron mobility showed an enhancement of similar to 40% with the incorporation of 0.25% carbon in strained-Si long channel NMOSFETs. However, no improvement was seen in the output characteristics of the strained-Si:C PMOSFET. The performance enhancement seen is less than the theoretical prediction for increasing carbon content; this is due to the high alloy scattering potential with carbon incorporation, high interface state density (D(it)) at the oxide/strained-Si:C interface and interstitial carbon induced Coulomb scattering. However, increased amounts of C may result in degraded device performance. Therefore, a balance must be struck to minimize C-induced extra Coulomb and alloy scattering rates in the fabrication of these devices. (C) 2008 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en_US | zh_TW |
dc.relation | Thin Solid Films | en_US |
dc.relation.ispartofseries | Thin Solid Films, Volume 517, Issue 1, Page(s) 105-109. | en_US |
dc.relation.uri | http://dx.doi.org/10.1016/j.tsf.2008.08.087 | en_US |
dc.subject | Strained-Si:C | en_US |
dc.subject | Mobility | en_US |
dc.subject | Strain | en_US |
dc.subject | Alloy scattering | en_US |
dc.subject | Interface state | en_US |
dc.subject | density | en_US |
dc.subject | SiGe buffer | en_US |
dc.subject | Carbon | en_US |
dc.subject | Transmission electron microscopy | en_US |
dc.subject | inversion-layers | en_US |
dc.subject | si1-xcx alloys | en_US |
dc.subject | band-structure | en_US |
dc.subject | mobility | en_US |
dc.subject | transistors | en_US |
dc.subject | scattering | en_US |
dc.subject | substrate | en_US |
dc.subject | channel | en_US |
dc.title | Studying the impact of carbon on device performance for strained-Si MOSFETs | en_US |
dc.type | Journal Article | zh_TW |
dc.identifier.doi | 10.1016/j.tsf.2008.08.087 | zh_TW |
Appears in Collections: | 光電工程研究所 |
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