Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4028
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dc.contributor.advisor林明澤zh_TW
dc.contributor.advisorMing-Tza Linen_US
dc.contributor.author陳俊宏zh_TW
dc.contributor.authorChen, Chun-Hungen_US
dc.contributor.other中興大學zh_TW
dc.date2012zh_TW
dc.date.accessioned2014-06-06T06:26:51Z-
dc.date.available2014-06-06T06:26:51Z-
dc.identifier.urihttp://hdl.handle.net/11455/4028-
dc.description.abstract本論文在探討薄膜材料中之銅薄膜受到一週期性外力之下,平均應力值對疲勞週期的影響,當材料受到一週期性反覆之應力,導致材料最終產生破壞的情形稱之為疲勞,因材料的疲勞行為發生時並無任何明顯的外觀改變,而是一種潛在的行為,若能了解材料之機械性質事先對其疲勞做估算,藉以預測元件之壽命,可防範因元件損傷造成傷害。 論文中所採用之試驗方式為單軸向微拉伸系統,藉由回授控制負載之平均應力,讓銅薄膜在承受相同平均應力之下直到破壞,再給予不同平均應力負載重複測試,觀察其疲勞週期變化,並描繪出銅薄膜材料之應力-週期數曲線圖,實驗中對三種銅薄膜厚度300奈米、500奈米及700奈米進行量測,並探討不同厚度對週期數的影響差異。 實驗結果顯示越高平均應力會越快導致材料疲勞破壞發生,而在不同厚度之間做比較發現,疲勞週期數會因薄膜越薄而有增加之趨勢。zh_TW
dc.description.abstractRecently, microelectronics related industry such as semiconductor and MEMS has grown rapidly. As the size of microsystem devices continues to decrease, the reliability and lifetime of device would be affected, with a corresponding need to understand how length scales affect mechanical behavior, accurate knowledge on the mechanical behaviors of thin-film materials has become important for the design of MEMS device. Our study focuses on the fatigue property of copper thin-film, subjected to a periodic external force with a mean stress. The material subjected to a repeated cyclical stress, resulting in the damage of material is called fatigue. When the fatigue behavior occurs, there is no any significant change in appearance. When the mechanical properties of materials could be understood to estimate the fatigue cycles, the damages of components could be prevented. The method of Experimental used an uniaxial micro-tensile system, with a feedback controlled loading for a mean stress, so that the copper thin-film under the same mean stress until it damage, and then repeated to give different mean stress, observe the fatigue cycle, and describe the S-N curve of copper thin-films. The experiment measured three thickness copper thin-films that include 300 nm, 500 nm and 700 nm to study the effects with different thickness. As a result, the higher mean stress would lead to material fatigue occurs sooner. To compare with different thickness of copper thin films, the fatigue cycles would increase when the thin-film became thinker.en_US
dc.description.tableofcontents第一章 序論……………………………………………….1 1.1 研究目的………………………………………………1 1.2 疲勞測試源由…………………………………………1 1.3 材料的選擇……………………………………………3 第二章 文獻探討………………………………………….4 2.1 導論……………………………………………………4 2.2 薄膜機械性質測試方法比較…………………………7 2.3 疲勞試驗介紹…………………………………………8 第三章 試件製作與設備架構……………………………11 3.1 前言………………………………………………….11 3.2 微拉伸試件製作…………………………………….12 3.2.1 微拉伸試件尺寸………………………………….12 3.2.2 微拉伸試件製程………………………………….13 3.2.3 微拉伸試件製程良率…………………………….17 3.3 微拉伸量測系統之架設…………………………….17 3.3.1 系統設計………………………………………….18 3.3.2 荷重計之設計…………………………………….20 3.3.3 荷重計之改良…………………………………….22 3.3.4 設備整體架設整合……………………………….25 3.4 微拉伸量測系統之校正…………………………….26 3.4.1 荷重計之電容值校正…………………………….26 3.4.2 荷重計之K值校正…………………………………29 3.4.2.1 利用已知彈性係數彈簧校準………………….29 3.4.2.2 吊掛砝碼校準………………………………….30 3.4.2.3 LVDT校準……………………………………….33 第四章 程式編寫與實驗步驟……………………………36 4.1 前言………………………………………………….36 4.2 拉伸試驗機控制系統的改進……………………….37 4.2.1 控制系統改進的目的…………………………….37 4.2.2 控制程式的改進………………………………….37 4.3 微拉伸試驗機控制程式之設計…………………….40 4.3.1 單軸微拉伸試驗機控制程式主體……………….40 4.3.2 疲勞試驗控制程式設計………………………….41 4.3.3 疲勞試驗之應力回授控制程式設計…………….43 4.3.4 資料儲存單元程式設計………………………….45 4.3.5 程式整合與設備保護設定……………………….46 4.4 實驗步驟及資料處理……………………………….49 4.4.1 單軸微拉伸試驗實驗步驟……………………….49 4.4.2 單軸微拉伸試驗資料處理及運算……………….50 4.4.3 疲勞試驗實驗步驟……………………………….51 4.4.4 單軸疲勞試驗實驗資料處理及運算…………….52 第五章 結果與討論………………………………………54 5.1 前言………………………………………………….54 5.2 單次拉伸量測結果………………………………….54 5.2.1 銅薄膜於厚度700奈米下之單次拉伸試驗………54 5.2.2 銅薄膜於厚度500奈米下之單次拉伸試驗………56 5.2.3 銅薄膜於厚度300奈米下之單次拉伸試驗………57 5.2.4 銅薄膜於三種厚度下之單次拉伸比較………….58 5.3 疲勞測試量測結果………………………………….59 5.3.1 銅薄膜於厚度700奈米下之疲勞測試……………59 5.3.2 銅薄膜於厚度500奈米下之疲勞測試……………62 5.3.3 銅薄膜於厚度300奈米下之疲勞測試……………64 5.3.4 銅薄膜於三種厚度下之測試結果比較………….66 5.4 結論………………………………………………….67 參考文獻………………………………………………….69zh_TW
dc.language.isoen_USzh_TW
dc.publisher精密工程學系所zh_TW
dc.subjectmicrotensileen_US
dc.subject微拉伸zh_TW
dc.subjectfatigueen_US
dc.subjectCu thin-filmen_US
dc.subject疲勞zh_TW
dc.subject銅薄膜zh_TW
dc.title微力試驗下之銅奈米結晶薄膜尺度與不同平均應力之疲勞行為探討zh_TW
dc.titleStudy on mean stress and thickness effects on fatigue behavior of nanocrystalline Cu thin filmsen_US
dc.typeThesis and Dissertationzh_TW
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