Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4092
標題: 建構一新穎之微拉伸試驗機制以量測次微米尺度薄膜材料之機械行為
Design and develop a novel microtensile apparatus to measure the mechanical properties of thin films
作者: 江忠勳
Jiang, Jung-Shiun
關鍵字: Piezoactuator
壓電致動器
LVDT Load cell
線性電壓差動變壓荷重計
出版社: 精密工程學系所
引用: 參考文獻 [1]. 黃俊勛,”2004第三季全球半導體市場剖析暨2005預測” [2]. W. D. Nix, Metallurg. Trans. 20A 2217 (1989). [3] . E. O. Hall, Proc. Phys. Soc. London 643 , 747 (1951). [4]. MRS spring meeting, Symposium O: Thin Films-Stresses and Mechanical Properties Mar. 28, 2005. [5]. R.P. Vinci and J. J. Vlassak, “Mechanical behavior of thin films,” Annu. Rev. Mater. Sci. 26 , 431-62 (1996). [6]. G.M. Pharr, W.C. Oliver, and F.R.Brotzen, “On the generality of the relationship among contact stiffness, contact area, and elastic modulus during indentation,” Journal of Materials Research, 7, pp 631-617, 1992. [7]. G.M. Pharr, and W.C. Oliver, “Measurement of thin film mechanical properties using nanoindentation,” MRS Bulltin, 7, pp 28-33, 1992. [8]. W.C. Oliver, and G.M. Pharr, “An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments,” Journal of Materials Research, 7, pp 1564-1583, 1992. [9]. Taljat, B. Zacharia, T.; Pharr, G.M. ” Pile-up behavior of spherical indentations in engineering materials”, Materials Research Society Symposium - Proceedings, v 522, Fundamentals of Nanoindentation and Nanotribology, p 33-38, 1998 [10]. M. G. Allen, M. Mehregany, R. T. Howe et al., “Microfabricated structures for the in situ measurement of residual stress, Young’s modulus, and ultimate strain of thin films,” Applied Physics Letters 51 (4), 241-3 (1987). [11]. A. J. Kalkman and A. H. Verbruggen, “High-temperature bulge-test setup for mechanical testing of free-standing thin films,” Rev. Sci. Instrum., Vol. 74, No. 3, March 2003 [12]. R. Spolenak, W.L. Brown, “Bulge testing of mechanical properties of thin copper films,” Lucent Tech., Bell Labs Innovations (2000). [13]. J. A. Schweitz, “Mechanical characterization of thin films by micromechanical techniques,” MRS Bulletin 17 (7), 34-45 (1992). [14]. T. P. Weihs, S. Hong, J. C. Bravman et al., “Mechanical deflection of cantilever microbeams: a new technique for testing the mechanical properties of thin films,” [15] .http://ceaspub.eas.asu.edu/imtl/HTML/Manuals/MC106_Constant_Stress.htm [16]. http://parts.jpl.nasa.gov/docs [17]. D. T. Read and J. W. Dally, “Strength, ductility, and fatigue life of aluminum thin films,” International Journal of Microcircuits and Electronic Packaging 16 (4), 313-18 (1993). [18]. http://www.csl.mete.metu.edu.tr/Electromigration/emig.htm [19]. Haque, M.A. and Saif, M.T.A., “In Situ Tensile Testing of nano-scale Specimens in SEM and TEM,” EXPERIMENTAL MECHANICS, 42(1), 123-128 (2001). [20]. M. Prieler, H. G. Bohn, W. Schilling et al. , “Grain boundary sliding in thin substrate- bonded Al films,” J. Alloys Compd. (Switzerland), Journal of Alloys and Compounds , 424-7 (1994). [21] Haibo Huang and F. Spaepen., ”Tensile testing of free-standing Cu,Ag and Al thin films and Ag/Cu multilayers,” Acta mater. 48(2000) 3261-3269 [22]. K. Jamting et al. Thin Solid Films, 304-309 (1997) [23]. Z.N. Farhat et al., Surface and Coatings Technology 89 (1997) 24-30 [24]. P. G. Sanders et al. Acta mater. Vol. 45, No. 10, pp. 4019-4025 (1997) [25]. D.T. Read, Int. J. Fatigue Vol. 20, No. 3, pp. 203-209. 1998 [26]. M. Legros et al., Philosophical magazine A, 2000, VOL. 80, NO. 4, 1017-1026 [27]. S. Suresh et al., Scripta Materialia, Vol. 41, No. 9, pp. 951–957, 1999 [28]. HAIBO HUANG et al., Acta mater. 48 (2000) 3261-3269 [29]. Jie-Hua Zhao et al., Journal of applied physisc VOLUME 87, NUMBER 3, 2000 [30]. Te-Hua Fang et al., Microelectronic Engineering 65 (2003) 231–238 [31]. Yong Zhou et al. Thin Solid Films 460 (2004) 175–180 [32]. Ya. M. Soifer et al. Materials Letters 59, 1434-1438 (2005)
摘要: 摘要 在此篇論文中針對目前文獻當中,對於以往微拉伸試驗上負載對準的問題加以改進,並建構一新穎之微拉伸機制以量測薄膜材料之機械行為,其獨特的感應樑柱設計使得材料受力與伸長量可藉由感測器直接測得,同時設計一新式電鍍製程製作微拉伸試件,提升試件製作的速率與良率,並利用此微拉伸試驗機測得銅與金薄膜材料的楊氏係數與降伏強度。
In this research, we present a novel designed microtensile testing apparatus that is capable of measuring the mechanical properties of free-standing thin film materials. Its unique sensor beam design causes stress and stain of the materials to be obtained directly and accurately. We also develop a new fabrication method by using the electroplating method to increase the sample fabricate success rate and yield. In addition, we also eliminate the loading misalignment problem of the previous microtensile testing. We have found the mechanical properties (Young s modulus, yield stress) of copper and gold thin films by using this system.
URI: http://hdl.handle.net/11455/4092
其他識別: U0005-1508200610222300
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-1508200610222300
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