請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/41006
標題: Effects of supporting electrolytes on copper electroplating for filling through-hole
作者: Chen, Chien-Hung
Lu, Chun-Wei
Huang, Su-Mei
Dow, Wei-Ping
關鍵字: Through-hole filling
Copper electroplating
Supporting electrolyte
出版社: Elsevier Ltd.
摘要: The filling of micron through-holes (THs) in a printed circuit board (PCB) by copper electroplating was investigated in this study. The role of supporting electrolytes, such as H2SO4, Na2SO4 and K2SO4, was explored using practical TH filling plating and linear-sweep voltammetry (LSV) analysis of plating solutions. The copper could selectively fill THs using one organic additive, namely, tetranitroblue tetrazolium chloride (TNBT), as an inhibitor. The inhibiting strength of TNBT depended on the supporting electrolytes. Although H2SO4 could enhance the inhibiting strength of TNBT, it also decreased the filling capability of the copper plating solution; Na2SO4 and K2SO4 did not enhance the inhibiting strength of TNBT but they increased the filling capability of the copper plating solution. Additionally, the protons could chemically interact with TNBT to form precipitate, whereas sodium and potassium ions did not easily interact with TNBT. The filling capability of the copper plating solution using Na2SO4 and K2SO4 as supporting electrolytes could be greatly improved by adding a small amount of bis(3-sulfopropyl)-disulfide (SPS) and poly(ethylene glycol) (PEG) with a molecular weight of 600.
URI: http://hdl.handle.net/11455/41006
ISSN: 0013-4686
顯示於類別:化學工程學系所

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