請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/41008
標題: Through-Hole Filling by Copper Electroplating Using a Single Organic Additive
作者: Dow, Wei-Ping
Liu, De-Huei
Lu, Chun-Wei
Chen, Chien-Hung
Yan, Jhih-Jyun
Huang, Su-Mei
出版社: The Electrochemical Society
摘要: A copper electroplating process using a single organic additive was developed for filling through holes of printed circuit boards. The organic additive acted as an inhibitor of copper deposition in the presence of chloride ions and H2SO4. This copper electroplating formula resulted in center-up filling, which differs from the bottom-up filling exhibited by blind microvias. The inhibiting strength of the organic additive and the filling capability of the plating solution strongly depended on the concentration of H2SO4. The electrochemical behavior of the organic additive was characterized by electrochemical analyses and imaging of TH cross sections.
URI: http://hdl.handle.net/11455/41008
ISSN: 1099-0062
顯示於類別:化學工程學系所

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