Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/41046
標題: Interfacial reactions between high-Pb solders and Ag
作者: Lin, Chi-Pu
Chen, Chih-Ming
Yen, Yee-Wen
Wu, Hsin-Jay
Chen, Sinn-Wen
關鍵字: Intermetallics
Metals and alloys
Liquid-solid reactions
Diffusion
Microstructure
出版社: Elsevier B.V.
摘要: Interfacial reactions between high-Pb solders (Pb-10Sn, Pb-5Sn, and Pb-3Sn, in wt.%) and immersion Ag layer at 350 °C are investigated. Upon decreasing the Sn concentration from 10 wt.% to 5 wt.%, the reaction product formed at the solder/Ag interface changes from the Ag3Sn phase to the Ag4Sn phase. When the Sn concentration reduces to only 3 wt.%, the reaction product is the Ag4Sn phase at the initial stage of reaction but transforms to the (Ag) phase dissolved with Sn at the later stage of reaction. Pb penetrates across the (Ag) phase via grain boundary and forms a continuous Pb-rich layer between the (Ag) phase and the bottom Cu layer. The correlation between the phase transformation and the solder composition is discussed based on the calculated Sn-Pb-Ag isothermal section.
URI: http://hdl.handle.net/11455/41046
ISSN: 0925-8388
Appears in Collections:化學工程學系所

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