Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/41205
標題: An approach to develop high-Tg epoxy resins for halogen-free copper clad laminates
作者: Lin, H.T.
林慶炫
Lin, C.H.
Hu, Y.M.
Su, W.C.
關鍵字: Phosphorus
Epoxy
Flame retardant
phosphorus-containing epoxy
flame-retardant thermosets
curing agents
mechanism
polymers
期刊/報告no:: Polymer, Volume 50, Issue 24, Page(s) 5685-5692.
摘要: A series of advanced epoxy resins (2) were prepared by the nucleophilic addition of cresol novolac epoxy (CNE) with a benzoxazine monomer (1), which is prepared by a one-pot procedure using 2-hydroxybenzaldehyde, 4-aminophenol and 9, 10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO) as starting materials. The nucleophilic addition was monitored by epoxy equivalent weight titration and NMR analysis. Based on this approach, the overall number of functionality of the resulting epoxy resins was retained because a curable benzoxazine linkage was also incorporated after the nucleophilic addition. As a result, high-Tg thermosets qualified for the UL-94 V-0 rating can be achieved after curing. When an UL-94 V-0 rating was achieved, Tg as high as 245 degrees C (DMA data) was obtained for 4,4'-diaminediphenyl sulfone (DDS)-cured systems. The corresponding phosphorus content for the UL-94 V-0 rating was as low as 0.61 wt%. The flame-retardant nature of oxazine linkage and nitrogen-phosphorus synergistic effect might be responsible for the low phosphorus content required for flame retardancy. (C) 2009 Elsevier Ltd. All rights reserved.
URI: http://hdl.handle.net/11455/41205
ISSN: 0032-3861
文章連結: http://dx.doi.org/10.1016/j.polymer.2009.09.075
Appears in Collections:化學工程學系所

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