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標題: 不同封裝基材用於紫外光發光二極體表面黏著型元件特性之影響
Effects of SMD Package Substrates on Performance of Ultraviolet Light-Emitting Diodes
作者: 陳建民
Chen, Jeming
關鍵字: Surface mount device ultraviolet light-emitting diode
ceramic substrate
thermal analysis
reliability analysis
出版社: 精密工程學系所
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摘要: 本論文之主要研究目為探討不同封裝基材用於表面黏著型紫外光發光二極體對其元件特性與可靠度之影響,同時以熱傳理論計算分析封裝材料之散熱好壞,並運用材料驗證方法找出紫外光發光二極體適合之封裝材料。 在實驗中我們選用波長為380 nm之氮化銦鎵發光二極體作成表面黏著型元件,利用量測儀器測試比較兩種塑料有引腳之晶片載板、低溫與高溫燒結陶瓷基板來比對四種基材封裝成元件之光電特性差異,結果發現以高溫燒結陶瓷基材封裝之紫外光發光二極體,其前後發光效率可提升44%,而塑料有引腳之晶片載板封裝則亮度分別衰減29.5%與33.5%。此外,在驅動電流20 mA的條件下,使用接面溫度量測系統測試此四種元件之接面溫度與熱阻,高溫燒結陶瓷基材封裝之元件的接面溫度是30.5
This dissertation describes the effects of packaging substrates on the performance of surface-mount ultraviolet (UV) InGaN light-emitting diodes (LEDs). By taking the heat transfer theory and material verification result into account, the optimization of the packaging materials for UV LEDs has been performed. We have selected the 380-nm UV LED chips for these experiments. Various packaging types have been attempted and show different optoelectronic characteristics after device measurements. There are two kinds of plastic with leaded chip carriers (PLCC), low-temperature co-fired ceramic (LTCC) substrate and high-temperature co-fired ceramic (HTCC) substrate. Experimental results show that the light extraction efficiency of HTCC UV LED can be improved up to 44%, and that of the PLCC sample is degraded down to 33.5%. Under a 20-mA current injection, the HTCC UV LED shows a junction temperature of 30.5
其他識別: U0005-0502200815561600
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