Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4170
標題: 以振動輔助之微元件自組裝
Shaking assisted self-assembly of rectangular-shaped microparts
作者: 廖本鉦
Liao, B-C
關鍵字: self-assembly
自組裝
shaking
alignment
振動
對位
出版社: 精密工程學系所
引用: Clark, T.D., Boncheva, M., German, J.M., Weck, M., and Whitesides, G.M., “Template-directed self-assembly of 10-(micro)m-sized hexagonal plates,” Journal of American Chemistry Socity, Vol. 124, pp.18-19, 2002. Fang, J., Wang, K., and Bohringer, K.F., ”Self-Assembly of PZT Actuators for Micropumps With High Process Repeatability,” Journal of Microeletromechanical Systems, Vol. 15, No. 4, pp. 871-878, 2006. Fonstad, C. G., " Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique," Advanced Materials for Micro- and Nano-Systems (AMMNS); Singapore-MIT Alliance Symposium, January 2002; available at http://hdl.handle.net/1721.1/3978 Gracias, D.H., Kavthekar, V., Love, J.C., Paul, K.E., and Whitesides G.M., “Self-organization processes in the chemistry of materials,” Advance Material, Vol. 14, pp. 235-238, 2002. Holmes, A.S., and Saidam, S.M., “Sacrificial layer process with laser-driven release for batch assembly operations,” Journal of Microelectromechanical Systems, Vol. 7, No. 4, pp. 416-422, 1998. Harsh, K.F., Irwin, R.S. and Lee, Y.C., “Solder self-assembly for MEMS,” Proc. of the 4th International Instrumentation Symposium, Reno, Nevada, pp. 256-261, 1998. Harsh, K.F, and Lee Y.C., ”Modeling for solder self-assembled MEMS,” Proc. of SPIE The International Society For Optical Engineerin, ISSUE 3289, pp. 177-185 ,1998, Jager, E.W.H., Smela, E., and Inganas, O., ”Microfabricating on jugated polymer actuators,” Science, Vol. 290, No. 5496, pp. 1540-1545, 2000. Jacobs, H.O., Tao, A.R., Schwartz, A., Gracias, D.H., and Whitesides, G.M., "Fabrication of a cylindrical display by patterned assembly," Science 12, Vol. 296, No. 5566, pp. 323-325, 2002. Molhave, K., Hansen, T.M., Madsen, D.N., and Boggild P., “Towards pick-and-place assembly of nanostructures,” Journal of Nanoscience and Nanotechnology, Vol. 4, pp. 279-282, 2004. McPhredran, R.C., Nicorovici, N. A., and Botten, L.C., “Learning Optics in Nature's school,” Aust. Opt. Soc. NEWS, Vol. 15, No. 2-3, pp. 7-9, 2001. Prasad, R., Bohringer, K.F., MacDonald, N.C., ”Design, fabrication, and characterization of single crystal silicon latching snap fasteners for micro assembly,” Proc. of ASME, International Mechanical Engineer Congress, San Francisco, CA, pp. 6-8, 1995. Quevy, E., ”3-D self-assembling and actuation of electrostatic microstructures” IEEE Transactions on Electron Devices, Vol. 48, No. 8, pp. 61-63, 2001. Syms, R.R.A., “Equilibrium of hinged and hingeless structures Rotated using surface tension forces,” Journal of Microelectromechanical Systems, Vol. 4, pp. 177-184, 1995. Saitou, K., and Jakiela, M.J., “Design of a self-closing compliant “mouse trap” for micro assembly,” Proc. of IMECE'98, Atlanta, Georgia, USA, pp. 17-22, 1998. Syms, R.R.A., “Equilibrium of hinged and hingeless structures rotated using surface tension forces,” Journal of Microelectromechanical Systems, Vol. 4, pp. 177-184, 1995. Syms, R.R.A., Yeatman, E.M., "Self-assembly of fully three-dimensional microstructures using rotation by surface tension forces," Electronics Letters, Vol. 29, pp. 662-664, 1993. Terfort, A., Bowden, N., and Whitesides, G.M., “Three-dimensional self-assembly of millimeter- scale components,” Nature, Vol. 386, pp. 162-164, 1997. Vikramaditya, B., Nelson, B.J., Yang, G.E., and Enikov, E.T., “Micro-assembly of hybrid magnetic MEMS,” Journal of Microelectromechanical Systems, Vol. 1, No. 2, pp. 99-116, 2001. Yeh, H.J.J., and Smith J.S., “Fluidic self-assembly of silicon microstructures,” IEEE Photon Technology Letters, Vol. 6, pp. 706-708, 1994.
摘要: 本研究探討以振動輔助長方形微元件之自組裝,長方形微元件可以在空氣環境下被自組裝對位在特定的方向上。在基板上只有長方形的 binding sites是親水性的,我們先將 solder 加溫至 85 ,再使用 dip-coating 製程,將融溶 solder 沾附在 binding sites 上,然後將微元件放置跟該對位的位子有大於 45° 以上的 misalignment angle,用振動輔助提供微元件旋轉的能量,使其對位,對位時間隨著 mismatch 的角度增加而增加, mismatch 的角度從15° 到 90°,而對位時間約為從 0.39 sec 到2.59 sec,而在對位成功率上,任何角度都有8成以上的對位成功率。基於此快速的自組裝對位與高的自組裝對位成功率,以振動輔助長方形微元件自組裝對位方式是非常實用及可行的。
A shaking assisted self-assembly method for rectangular-shaped microparts is developed. Rectangular microparts are assembled to their specific in-plane orientations in an air environment. Rectangular binding sites are the only hydrophilic areas on the substrate. By a dip-coating process, molten solders wet only the binding sites. The microparts with initial misalignment angle greater than can be rotated and translated to align with the binding sites under orbital shaking. Before the shaking, the solder is reflowed by heating to C. Alignment between PZT actuators and binding sites took place within 0.39 to 2.59 seconds for the initial misalignment angles ranging from 15° to 90°. The alignment yield is more than 80﹪at any misalignment angle .
URI: http://hdl.handle.net/11455/4170
其他識別: U0005-0307200816490800
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-0307200816490800
Appears in Collections:精密工程研究所

文件中的檔案:

取得全文請前往華藝線上圖書館



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.