Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/41992
標題: Microvia filling by copper electroplating using diazine black as a leveler
作者: Dow, W.P.
竇維平
Li, C.C.
Su, Y.C.
Shen, S.P.
Huang, C.C.
Lee, C.
Hsu, B.
Hsu, S.
關鍵字: Copper electroplating
Leveler
Microvia filling
acidic sulfate-solutions
janus-green-b
polyethylene-glycol
chloride-ions
4,5-dithiaoctane-1,8-disulfonic acid
damascene
electrodeposition
competitive adsorption
organic additives
bump
formation
peg
期刊/報告no:: Electrochimica Acta, Volume 54, Issue 24, Page(s) 5894-5901.
摘要: An organic additive, Diazine Black (DB), was employed as a leveler for microvia filling using copper electroplating. DB is a derivative of Janus Green B (JGB), which is a common leveler used for copper fill of submicron or micron circuit metallization in electronic products. This study determined the optimal DB concentration for achieving the best filling performance. The electrochemical behavior of DB and its interaction with other additives, such as a suppressor and an accelerator were characterized using galvanostatic measurements. These electrochemical analyses helped explaining the filling mechanism of the plating formula containing the DB. Various surface morphologies and the crystalline orientation of the plated copper films caused by different DB concentrations were characterized by a scanning electron microscope (SEM) and X-ray diffraction (XRD), respectively. The corresponding chemical activity of the surface atoms of the plated copper films caused by different DB concentrations was characterized using a test of etching rate. (C) 2009 Elsevier Ltd. All rights reserved.
URI: http://hdl.handle.net/11455/41992
ISSN: 0013-4686
文章連結: http://dx.doi.org/10.1016/j.electacta.2009.05.053
Appears in Collections:化學工程學系所

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