Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/42112
標題: Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations
作者: Lin, Chi-Pu
Chen, Chih-Ming
摘要: A tri-layer of nickel/palladium/gold (Au/Pd/Ni) is a promising candidate to replace the conventional Au/Ni bi-layer as the surface finish metallization for lead-free packaging. A surface finish metallization (Au/Pd/ Ni or Au/Ni) and a Sn layer are sequentially deposited on a Cu substrate and then are subjected to thermal aging at 150 and 200 C to investigate the interfacial reactions in the stacking multilayer structure made by low-temperature solid-state bonding. Because of the absence of the reflow process, the Pd and Au layers do not dissolve in the Sn matrix but remain at the interface and participate in the interfacial reaction to form the (Pd,Ni,Au)Sn4 and (Au,Ni)Sn4 phases at the Au/Pd/Ni- and Au/Ni-based interfaces, respectively. Though the Pd layer was only 0.4 lm, its resulting (Pd,Ni,Au)Sn4 phase is much thicker than the (Au,Ni)Sn4 phase. These two intermetallic compounds exhibit very different microstructural evolution which significantly affects the interfacial microstructures and growth rate of other intermetallic compound formed at the same interfaces.
URI: http://hdl.handle.net/11455/42112
ISSN: 0026-2714
文章連結: http://dx.doi.org/10.1016/j.microrel.2011.03.007
Appears in Collections:化學工程學系所

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