Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4290
標題: 以電鑄製程製作之三穩態微機構
Fabrication of a tristable micromechanism by electroforming
作者: 許桓齊
Hsu, Huan-Chi
關鍵字: UV-LIGA
UV-LIGA
三穩態結構
銅犧牲層
鎳結構層
tristable micromechanism
Cu sacrificial layer
Ni structural layer
出版社: 精密工程學系所
引用: Andricacos, P. C., Tabib, J., and Romankiw, L. T., (1989), Stripping voltammetry of Nickel-Iron film electrodepostion on platinum using a RRDE, J. Electrochem. 136, 1172. Arai, F., (2010), On-chip robotics: Technical issues and future direction, 2010 IEEE International Conference on Robotics and Automation Workshop on Micro-Nano Robotics and New Evolution, Anchorage, Alaska, . Chen, G., Wilcox, D. L., and Howell, L. L., (2009), Fully compliant double tensural tristable micromechanisms (DTTM), Jouranl of Micromechanics and Microengineering, 19, 025011. Chen, G., Aten, Q. T., Zirbel, S., Jensen, B. D., and Howell, L. L., (2010), A tristable mechanism configuration employing orthogonal compliant mechanisms, Journal of Mechanisms and Robotics, 2, 014501. Chen, G., Gou, Y., and Yang, L., Research on multistable compliant mechanisms: The state of the art, Proceedings of the 9th International Conference on Frontiers of Design and Manufacturing (ICFDM 2010), July 17–19 2010, Changsha, China, 1–5, 2010. Dennis, J. K., and Such, T. E., (1993), Nickel and chromium plating, Woodhead Publishing Ltd, England. Gerson, Y., Krylov, S., Ilic, B., and Schreiber, D., (2008), Large displacement low voltage multistable micro actuator, Proceedings of the IEEE 21st International Con-ference on Micro Electro Mechanical Systems, Jan 13-17, 463. Guimin, C., Yanjie, G., and Aimei, Z., (2011), Synthesis of compliant multistable mechanisms through use of a single bistable mechanism, Journal of Mechanical Design, 133 (8), 081007. Healy, J. P., and Pletcher, D., (1992), The chemistry of the additives in an acid copper electroplating bath Part II. The instability of 4,5-dithiaoctane-1,8-disulphonic acid in the bath on open circuit, J. Electroanal. Chem., 338, 167-177 Huang, C. H., (1993), Effect of organic additives on electroformed nickel alloys, Met-al Finishing, 138. Howell, L. L., (2001), Compliant mechanisms, John Wiley & Sons Inc. New York, USA,. Hull, P. V., and Canfield, S., (2006), Optimal synthesis of compliant mechanisms using subdivision and commercial FEA, Journal of Mechanical Design, 128, 337. Han, J. S., Muller, C., Wallrabe, U., and Korvink, J. G., (2007), Design, Simulation, and fabrication of a quadstable monolithic mechanism with X- and Y-directional bi-stable curved beams, Journal of Mechanical Design, 129, 1198. Larsen, U. D., Sigmund, O., and Bouwstra, S., (1997), Design and fabrication of com-pliant micromechanisms and structures with negative poisson’s ratio, Journal of Microelectromechanical Systems, 6, 99. Oberhammer, J., Tang, M., Liu, A. -Q., and Stemme, G., (2006), Mechanically tri-stable, true single-pole-double-throw (SPDT) switches, Journal of Micromechanics and Microengineering, 16, 2251. Oh Y.S., (2008), Synthesis of multistable equilibrium compliant mechanisms, Ph.D. thesis, The University of Michigan, Ann Arbor, Michigan,. Oh, Y. S., and Kota, S., (2009), Synthesis of multistable equilibrium compliant mechanisms using combinations of bistable mechanisms, Journal of Mechanical De-sign, 131, 021002. Pendleton, T., and Jensen, B., (2007), Development of a tristable compliant mecha-nism, Proceedings of the 12th IFToMM World Congress, June 18-21, 835. Qu, N. S., Chan, K. C., and Zhu, D., (1997), Suface roughening in pulse current and pulse reverse current electroforming of nickel, Surface and Coatings Technology, 91, 220-224. Taephaisitphongse, P., Cao, Y., and West, A. C., (2001), Electrochemical and fill stud-ies of a multicomponent additive package for copper deposition, J. Electrochem, 148, C492-C497. Wei, Z. J., Wang, Y. Y., Wan, C. C., and Huang, C. H., (2000), Study of wetters in nickel electroforming of 3D microstructures, Material Chemistry and Physics, 63, 235-239. Wilcox, D. L., and Howell, L. L., (2005), Fully compliant tensural bistable micromechanisms, Journal of Microelectromechanical Systems, 14, 1223. Wang, D. -A., and Pham, H. T., (2011), A quadristable compliant mechanism with a bistable structure embedded in a surrounding beam structure, Sensors and Actuators A-Physical, 167, 2, 438. Wang, D. -A., Chen, J. -H., and Pham, H. T., (2013), A constant-force bistable micromechanism, Sensors and Actuators A-Physical, 189, 481.
摘要: 本研究採用 UV-LIGA 製程技術,取代傳統的矽基微加工製程,利用微影與電鑄製程,在玻璃基板上製作出鎳金屬微結構的三穩態機構,並利用量測系統平台,以探針推動三穩態結構,量測此微結構在作動時的力與位移特性。 在製程方面,以微影製程製作出懸空的三穩態微結構,本研究以犧牲層技術,銅、鎳金屬之間附著性良好與蝕刻選擇比大的特性,並且以鈦金屬作為種子層,製程參數之設定與了解厚膜正光阻AZ-4620 性質,皆為此研究的主要內容,而製程參數包括軟烤時間、軟烤溫度、曝光時間、顯影時間、鍍液配方,製程方法包括,改變脈衝電流(Pulse and pulse-reverse current)大小,用兩階段電流的沉積方式製作微結構,提高鍍層表面品質。並使用量測設備,測量紀錄撓性三穩態機構之力與位移曲線特性,以證明撓性三穩態機構具三個穩態位置。
This research work by the UV-LIGA process in place of the traditional Silicon-based micromachining. We manufactured Ni tristable micromechanism on glass substrates with lithography and electrodeposition. And using the measurement system platform to promote the tristable micromechanism probe, measuring this tristable micromechanism of force & movement stage from tristable micromechanism. In the fabrication aspect, we built a tristable micromechanism by Lithography in-troduction. This research created a Ti seed layer and used characteristic of good adhe-sion and big differentiation of etching between Cu and Ni of sacrificial layer technology. The main research topics are setting the parameters and interpret the characteristic of photoresist AZ-4620. The parameters of fabrication include soft bake, exposure, devel-opment and Plating solution formulationsare investigated. And built a micromechanism by two stages electroplating and changed the scale of Pulse and pulse-reverse current for improve plating level and quality. Proved the a constant force tristable micromechanism possess three stables by measured and enroll the force & movement stage from tristable micromechanism.
URI: http://hdl.handle.net/11455/4290
其他識別: U0005-1808201321443000
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-1808201321443000
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