請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/43575
標題: Deformation behavior of electrolessly deposited ultrafine nanocrystalline copper films under instrumented nanoindentation
作者: Chang, S.Y.
張守一
Chang, T.K.
Lee, Y.S.
關鍵字: thin-films
electrochemical deposition
palladium catalysts
indentation
stress
cu
metallization
temperature
plasticity
strength
期刊/報告no:: Electrochemical and Solid State Letters, Volume 9, Issue 4, Page(s) C73-C76.
摘要: The deformation behavior of electrolessly deposited nanocrystalline copper films with an ultrafine grain size of about 10 nm has been investigated in this study by using instrumented nanoindentation. The hardness, shear stress for plastic yielding, and energy release rate of the electroless copper films were obviously lower than those of electroplated copper films with a larger grain size due to the dominant deformation mechanism of grain-boundary sliding and grain rotation instead of dislocation activity. Voiding at grain boundaries and triple grain junctions was observed in the indented region as a consequence of grain boundary sliding and grain rotation. (c) 2006 The Electrochemical Society.
URI: http://hdl.handle.net/11455/43575
ISSN: 1099-0062
文章連結: http://dx.doi.org/10.1149/1.2173190
顯示於類別:材料科學與工程學系

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