請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/43577
標題: Early-stage nucleation crystallography of sensitization-activated palladium catalysts and electrolessly deposited copper films
作者: Sung, Y.C.
張守一
Lai, C.H.
Lin, S.J.
Chang, S.Y.
關鍵字: ultralarge-scale integration
electrochemical deposition
titanium
nitride
barrier layers
cu deposition
metallization
interconnections
growth
期刊/報告no:: Electrochemical and Solid State Letters, Volume 9, Issue 5, Page(s) C85-C87.
摘要: The atomic-scale crystallography of early-stage nucleation of sensitization-activated palladium (Pd) catalysts and electrolessly plated copper (Cu) films has been investigated. Small Pd nanocrystallites of 5-10 nm were uniformly distributed as a single layer. Neighboring Pd nanocrystallites exhibited similar crystallography irrelevant to the random orientations of polycrystalline TaN substrate. Subsequently deposited Cu nanocrystallites of only 1 nm with small-angle boundaries nucleated on the Pd nanocrystallites with an orientation relationship of Cu [111] parallel to Pd [111]. In comparison, displacement-activated Pd preferentially nucleated on TaN, and Cu followed the orientation of Pd grains with a relationship of Cu [111] parallel to Pd [200]. (c) 2006 The Electrochemical Society.
URI: http://hdl.handle.net/11455/43577
ISSN: 1099-0062
文章連結: http://dx.doi.org/10.1149/1.2186027
顯示於類別:材料科學與工程學系

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