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|標題:||Nanomechanical response and creep behavior of electroless deposited copper films under nanoindentation test|
|期刊/報告no：:||Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, Volume 423, Issue 1-2, Page(s) 52-56.|
|摘要:||The nanomechanical response and creep behavior of electroless plated copper (Cu) films have been investigated in this research by using a nanoindentation test. The hardness and elastic modulus of the nanostructural Cu films with a large amount of small grains in size of only 5 mn were measured as 1.5 and 120 GPa, respectively. The Cu films deformed elastically at first and then yielded at a stress of 3.3 GPa. Grain-boundary sliding and grain rotation were expected to dominate the deformation of the Cu films. The Cu films showed a creep strain rate of about 5 x 10(-5) s(-1) under the nanoindentation test, and the creep strain rate-stress relation exhibited a typical power law expression with a stress exponent of 6.4. The high creep strain rate but low stress exponent of the Cu films implied a fixed creep behavior consisting of grain-boundary sliding and grain rotation by the fast diffusion of Cu atoms through the large amount of grain-boundary. (c) 2006 Elsevier B.V. All rights reserved.|
|Appears in Collections:||材料科學與工程學系|
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