Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/43723
標題: Effect of coating thickness and roughness on water-repellency and thermally induced voids/cracks in copper-coated optical fibers prepared by electroless plating method
作者: Chu, R.S.
薛顯宗
Shiue, S.T.
Yang, T.J.
Wu, T.C.
Lin, H.Y.
關鍵字: optical fiber
copper
electroless plating
stress
chemical-vapor-deposition
induced stress voids
mechanical strength
carbon coatings
silica
films
metallization
ulsi
期刊/報告no:: Journal of the Chinese Institute of Engineers, Volume 30, Issue 3, Page(s) 503-510.
摘要: The effect of coating thickness and roughness on water-repellency and thermally induced voids/cracks in copper-coated optical fibers is investigated. Seven samples of copper-coated optical fibers with identical fiber length but different coating thicknesses were prepared using electroless plating. The thicknesses of copper coatings were 62, 89, 127, 154, 165, 206, and 25 1 nm, respectively. Atomic force microscope measurement reveals that the roughness of copper coating increases when increasing the coating thickness. It is found that if the coating thickness is less than 89 nm, the water contact angle slightly increases with increasing the coating thickness, while fewer thermally induced voids/cracks are found in copper coatings. If the coating thickness is in the range of 89 to 25 1 nm, the water contact angle decreases when increasing the coating thickness, while the number of thermally induced voids/cracks increases when increasing the coating thickness. To get copper-coated optical fibers with high water-repellency and few thermally induced voids/cracks, the surface roughness of copper coatings should be diminished.
URI: http://hdl.handle.net/11455/43723
ISSN: 0253-3839
文章連結: http://dx.doi.org/10.1080/02533839.2007.9671278
Appears in Collections:材料科學與工程學系

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