請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/43902
標題: Etching of platinum thin films in an inductively coupled plasma
作者: Wuu, D.S.
洪瑞華
Kuo, N.H.
Liao, F.C.
Horng, R.H.
Lee, M.K.
武東星
關鍵字: platinum
plasma processing and deposition
etching
halogens
期刊/報告no:: Applied Surface Science, Volume 169, Page(s) 638-643.
摘要: Experimental studies of the etching of platinum thin films have been performed with a photoresist mask in an inductively coupled plasma. The physical bombardment by incident Ar ions dominates the platinum etch rate. In order to minimize the formation of sidewall deposition, the effects of the addition of various halogen gases to Ar plasma were evaluated. For the blanket platinum samples etched in Ar/CF4 plasmas, the existence of Pt-F compounds was found by using secondary ion mass spectrometry, By adding CFS in Ar/Cl-2 gas plasmas, an increase of etch rate for platinum films was observed. This suggests that the addition of CF4 to the Ar/Cl-2 gas mixture could enhance the reaction between platinum and fluorine on the platinum surface by providing more fluorine radicals and ions. The respective etch contribution provided by the three components (Ar, CF4 and Cl-2) has been investigated. A fence-free platinum electrode can be obtained under an optimum Ar/CF4/Cl-2 gas mixture ratio, resulting in an etch rate of 48 nm/min. (C) 2001 Elsevier Science B.V. All rights reserved.
URI: http://hdl.handle.net/11455/43902
ISSN: 0169-4332
文章連結: http://dx.doi.org/10.1016/s0169-4332(00)00803-5
顯示於類別:材料科學與工程學系

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