請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/44050
標題: Improvements of permeation barrier coatings using encapsulated parylene interlayers for flexible electronic applications
作者: Chen, T.N.
洪瑞華
Wuu, D.S.
Wu, C.C.
Chiang, C.C.
Chen, Y.P.
Horng, R.H.
武東星
關鍵字: barrier
flexible electronics
multilayers
parylene
water-vapor
permeability
light-emitting devices
technology
displays
layers
films
期刊/報告no:: Plasma Processes and Polymers, Volume 4, Issue 2, Page(s) 180-185.
摘要: A multilayer barrier structure composed of silicon nitride, silicon oxide, and encapsulated parylene on a polycarbonate substrate has been investigated for flexible electronic applications. The organic buffer is commonly used as the smoothing, strengthening and defect-decoupling layer. However, a lateral leakage problem was observed in the organic interlayer, and resulted in increased permeation and poor adhesion between organic and inorganic layers. It was found that an encapsulated, thermal-treated parylene interlayer can be used to efficiently reduce the water vapor and oxygen permeation. After 75 d, the water vapor transmission rate (WVTR) can reach 2.5 x 10(-7) (g. m(-2)) d(-1), as calculated by the calcium test. After being flexed for 5 000 times, the WVTR value almost keeps around 2.1 x 10(-6) (g.m(-2)) d(-1). The performance of the proposed multilayer barrier structure has a high potential for flexible solar cell and organic light-emitting diode applications.
URI: http://hdl.handle.net/11455/44050
ISSN: 1612-8850
文章連結: http://dx.doi.org/10.1002/ppap.200600158
顯示於類別:材料科學與工程學系

文件中的檔案:
沒有與此文件相關的檔案。


在 DSpace 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。