請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/44067
標題: Water and oxygen permeation of silicon nitride films prepared by plasma-enhanced chemical vapor deposition
作者: Wuu, D.S.
洪瑞華
Loa, W.C.
Chiang, C.C.
Lin, H.B.
Chang, L.S.
Horng, R.H.
武東星
關鍵字: plasma processing and deposition
silicon nitride
polymers
permeation
displays
growth
期刊/報告no:: Surface & Coatings Technology, Volume 198, Issue 1-3, Page(s) 114-117.
摘要: Silicon nitride (SiNx) films deposited on flexible polyethersulfone (PES) substrates by plasma-enhanced chemical vapor deposition (PECVD) have been investigated for water vapor transmission rate (WVTR) and oxygen transmission rate (OTR) barrier applications. Details of the NH3/SiH4 flow ratio and chamber pressure effects on the SiNx/PES properties in terms of chemical bonding, transmittance, refractive index, deposition rate, adhesion, roughness, OTR and WVTR were investigated. When the NH3/SiH4 flow ratio increased from 1.43 to 10, evident variations in refractive index and transmittance of the SiNx/PES samples were observed. Moreover, as the chamber pressure increases from 26.7 to 133.4 Pa, the deposition rate, adhesion and roughness increase while no evident variations in WVTR and OTR were observed. Under optimum conditions, the WVTR and OTR of 100-nm-thick SiNx barrier coating on PES at 150 degrees C decreased to a value of near 0.01 g/m(2)/day and 0.01 cm(3)/m(2)/day, respectively. This indicates that the SNx barrier on PES has high potential for flexible display applications. (c) 2004 Elsevier B.V. All rights reserved.
URI: http://hdl.handle.net/11455/44067
ISSN: 0257-8972
文章連結: http://dx.doi.org/10.1016/j.surfcoat.2004.10.034
顯示於類別:材料科學與工程學系

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