Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/44100
標題: Thermal stability improvement of vertical conducting green resonant-cavity light-emitting diodes on copper substrates
作者: Huang, S.Y.
洪瑞華
Horng, R.H.
Liu, P.L.
Wu, J.Y.
Wu, H.W.
Wuu, D.S.
武東星
劉柏良
關鍵字: InGaN
junction temperature
laser lift-off (LLO)
resonant-cavity
light-emitting diode (RCLED)
molecular-beam epitaxy
mirrors
期刊/報告no:: Ieee Photonics Technology Letters, Volume 20, Issue 9-12, Page(s) 797-799.
摘要: Green light vertical-conducting resonant-cavity light-emitting diodes.(RCLEDs) have been fabricated on a Cu substrate by the combination of laser lift-off and plating techniques. The structure of the RCLED/Cu is consisted of the InGaN-GaN multiple-quantum-well active layer between three layers of the dielectric TiO2-SiO2 distributed Bragg reflector as a top mirror and an Al metal layer as a bottom mirror. It was found that the RCLED with Cu substrate presents superior thermal dissipation and a stable electroluminescence emission peak wavelength (similar to 507 nm) under a high injection current. It is attributed to the Cu substrate providing a good heat sink and effectively reducing the junction temperature.
URI: http://hdl.handle.net/11455/44100
ISSN: 1041-1135
文章連結: http://dx.doi.org/10.1109/lpt.2008.921120
Appears in Collections:材料科學與工程學系

文件中的檔案:

取得全文請前往華藝線上圖書館



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.