Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46638
標題: High fill-factor microlens array mold insert fabrication using a thermal reflow process
作者: 楊錫杭
Yang, H.H.
Chao, C.K.
Wei, M.K.
Lin, C.P.
關鍵字: photoresist
lens
期刊/報告no:: Journal of Micromechanics and Microengineering, Volume 14, Issue 8, Page(s) 1197-1204.
摘要: An extreme high fill-factor microlens array mold insert in photoresist fabrication using a thermal reflow process is presented. The experimental results proved that a square microlens array could be produced without a peripheral gap. A square microlens array with an extreme high fill-factor (almost 100%) was successfully fabricated. In this experiment, square photoresist columns were formed on a silicon substrate using a lithographic process. The square pattern was laid out in an ortho-square on a polyethylene terephthalate (PET) based mask. Precise temperature and time control was used during the thermal reflow process. The square microlens array was formed from the uniformly flowing melted photoresist. The photoresist column surface transforms into a spherical profile due to the surface tension effect. The error was within +/-8% between the fabricated microlens characteristics and the theoretical model used to predict the photoresist column thickness and actual thickness. This model is feasible for fabricating various sized high fill-factor square microlens arrays.
URI: http://hdl.handle.net/11455/46638
ISSN: 0960-1317
文章連結: http://dx.doi.org/10.1088/0960-1317/14/8/012
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