Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46690
標題: New electroforming technology pressure aid for LIGA process
作者: Tsai, T.H.
楊錫杭
Yang, H.
Chein, R.
簡瑞與
期刊/報告no:: Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, Volume 10, Issue 5, Page(s) 351-356.
摘要: A new microelectroforming technique using air-pressure assistance in the electrolyte is introduced. The related theories and experiments are reported in this paper. The pressurized electrolyte reduces hydrogen bubble formation and defect on the substrate surface. The high pressure electrolyte limits bubble formation in electroforming. It also produces good throwing power from the experimental sample observations. The edges of the electroformed workpiece using the pressurized method were smoother than those produced using conventional electroforming. The metallurgical grains were finer when higher pressures were applied in the electrolyte based on SEM micrographs. Pressurized electroforming can increase the allowable current density, which can shorten plating time in the LIGA process. The high growth rate due to large applied current density results in large electroforming microstructure grains. The surface morphology of pressurized electroformed samples were improved compared with the conventional method.
URI: http://hdl.handle.net/11455/46690
ISSN: 0946-7076
文章連結: http://dx.doi.org/10.1007/s00542-004-0425-0
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