Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46719
標題: (Journal of Micromechanics and Microengineering,14(6):1197-1204)High fill-factor microlens array mold insert fabrication using a thermal reflow process
作者: H. Yang
C.K. Chao
M.K. Wei
C.P. Lin
關鍵字: High fill-factor
microlens array mold
insert fabrication
thermal reflow process
出版社: USA:Institute of Physics Publishing
URI: http://hdl.handle.net/11455/46719
Appears in Collections:精密工程研究所

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