Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46731
標題: (Journal of Micromechanics and Microengineering,12(5):611-615)A low-temperature wafer bonding technique using patternable materials
作者: C.T. Pan
H. Yang
S.C. Shen
M.C. Chou
H.P. Chou
關鍵字: Electronics
devices Nanoscale science
low-D systems
出版社: USA:Institute of Physics Publishing
URI: http://hdl.handle.net/11455/46731
Appears in Collections:精密工程研究所

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