Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46733
標題: (Microsystem Technologies,07:036-039)Microcomposite electroforming for LIGA technology
作者: M.C. Chou
H. Yang
S.H. Yeh
關鍵字: Microcomposite electroforming
LIGA technology
出版社: Germany:Springer Berlin
URI: http://hdl.handle.net/11455/46733
Appears in Collections:精密工程研究所

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