Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/47902
標題: 線性CMP製程與實驗機台之研究-子計畫III:CMP拋光墊性能分析與監控技術發展
Technology Development of CMP Polishing Pad Performance Analysis and Monitoring
作者: 陳昭亮
王國禎
關鍵字: 應用研究
Chemical mechanical polishing (CMP)
機械工程類
化學機械拋光
晶圓
拋光墊
性能指標
Wafer
Polishing pad
Performance index
URI: http://hdl.handle.net/11455/47902
其他識別: NSC88-2212-E005-014
文章連結: http://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=419142&plan_no=NSC88-2212-E005-014&plan_year=88&projkey=PB8801-0420&target=plan&highStr=*&check=0&pnchDesc=%E7%B7%9A%E6%80%A7CMP%E8%A3%BD%E7%A8%8B%E8%88%87%E5%AF%A6%E9%A9%97%E6%A9%9F%E5%8F%B0%E4%B9%8B%E7%A0%94%E7%A9%B6---%E5%AD%90%E8%A8%88%E7%95%ABIII%EF%BC%9ACMP%E6%8B%8B%E5%85%89%E5%A2%8A%E6%80%A7%E8%83%BD%E5%88%86%E6%9E%90%E8%88%87%E7%9B%A3%E6%8E%A7%E6%8A%80%E8%A1%93%E7%99%BC%E5%B1%95
Appears in Collections:機械工程學系所

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