Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/48051
標題: 晶圓銅薄膜平坦化製程技術研究-總計畫(I)
Investigation on the Copper Thin-Film Planarization Processes (I)
作者: 王國禎
關鍵字: 機械工程類
技術發展
URI: http://hdl.handle.net/11455/48051
其他識別: NSC92-2212-E005-008
文章連結: http://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=862990&plan_no=NSC92-2212-E005-008&plan_year=92&projkey=PB9208-1248&target=plan&highStr=*&check=0&pnchDesc=%E6%99%B6%E5%9C%93%E9%8A%85%E8%96%84%E8%86%9C%E5%B9%B3%E5%9D%A6%E5%8C%96%E8%A3%BD%E7%A8%8B%E6%8A%80%E8%A1%93%E7%A0%94%E7%A9%B6---%E7%B8%BD%E8%A8%88%E7%95%AB%28I%29
Appears in Collections:機械工程學系所

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