Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/48143
標題: 線性CMP拋光製程與實驗機台研製-子計畫IV:CMP拋光製程監控整合技術發展
In-Situ Process Monitoring and Control for the Chemical Mechanical Polishing
作者: 王國禎
關鍵字: 技術發展
Parameter optimization
機械工程類
參數最佳化
終點偵測
閉迴路製程控制
化學機械拋光
End point detection
Closed loop process control
Chemical mechanical polishing (CMP)
URI: http://hdl.handle.net/11455/48143
其他識別: NSC89-2212-E005-018
文章連結: http://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=526455&plan_no=NSC89-2212-E005-018&plan_year=89&projkey=PB8905-0502&target=plan&highStr=*&check=0&pnchDesc=%E7%B7%9A%E6%80%A7CMP%E6%8B%8B%E5%85%89%E8%A3%BD%E7%A8%8B%E8%88%87%E5%AF%A6%E9%A9%97%E6%A9%9F%E5%8F%B0%E7%A0%94%E8%A3%BD---%E5%AD%90%E8%A8%88%E7%95%ABIV%EF%BC%9ACMP%E6%8B%8B%E5%85%89%E8%A3%BD%E7%A8%8B%E7%9B%A3%E6%8E%A7%E6%95%B4%E5%90%88%E6%8A%80%E8%A1%93%E7%99%BC%E5%B1%95
Appears in Collections:機械工程學系所

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