Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/48593
標題: 應用於微型麥克風元件之低溫晶圓鍵合技術開發
Low-Temperature Wafer Bonding Technique for Miniature Microphone Applications
作者: 洪瑞華
關鍵字: 技術發展
電子電機工程類
URI: http://hdl.handle.net/11455/48593
其他識別: NSC91-2622-E005-015-CC3
文章連結: http://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=792129&plan_no=NSC91-2622-E005-015-CC3&plan_year=91&projkey=PB9112-0117&target=plan&highStr=*&check=0&pnchDesc=%E6%87%89%E7%94%A8%E6%96%BC%E5%BE%AE%E5%9E%8B%E9%BA%A5%E5%85%8B%E9%A2%A8%E5%85%83%E4%BB%B6%E4%B9%8B%E4%BD%8E%E6%BA%AB%E6%99%B6%E5%9C%93%E9%8D%B5%E5%90%88%E6%8A%80%E8%A1%93%E9%96%8B%E7%99%BC
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