Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/48724
標題: The Effect of High Temperature Anneal on the Warpage Control of the Poly-back Silicon Wafers
熱處理對背覆多晶矽重摻CZ矽晶片之撓曲度的影響
作者: 貢中元
關鍵字: 熱處理
Heat treatment
材料科技
翹曲
矽晶片
高溫退火
應用研究
Warpage
Silicon wafer
High temperature annealing
URI: http://hdl.handle.net/11455/48724
其他識別: NSC90-2215-E005-003
文章連結: http://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=665327&plan_no=NSC90-2215-E005-003&plan_year=90&projkey=PB9009-0749&target=plan&highStr=*&check=0&pnchDesc=%E7%86%B1%E8%99%95%E7%90%86%E5%B0%8D%E8%83%8C%E8%A6%86%E5%A4%9A%E6%99%B6%E7%9F%BD%E9%87%8D%E6%91%BBCZ%E7%9F%BD%E6%99%B6%E7%89%87%E4%B9%8B%E6%92%93%E6%9B%B2%E5%BA%A6%E7%9A%84%E5%BD%B1%E9%9F%BF
Appears in Collections:電機工程學系所

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