請用此 Handle URI 來引用此文件: http://hdl.handle.net/11455/5755
標題: 產業自願性減碳執行成果分析探討-以某半導體廠為例
A Study on Voluntary Carbon Reduction of a Semiconductor Company
作者: 柯孟志
Ke, Meng-Chih
關鍵字: greenhouse gas reduction
溫室氣體減量
semiconductor
PFCs
半導體
PFCs
出版社: 環境工程學系所
引用: 王塗發,「溫室氣體減量法立法經驗談」,COP15之後的國際氣候政策與立法趨勢論壇,(2010/4) 申永順,「溫室氣體減量與能源政策」,能源技術服務業專業人員訓練,(2008) 台灣非二氧化碳溫室氣體排放減量資訊網( http://non-co2.saveoursky.org.tw/reduce.asp ) , (2010/07/10) 行政院環境保護署,「全氟化物PFCs排放減量防制技術手冊」,(2009) 行政院環境保護署,「產業溫室氣體盤查管理技術手冊」,(2007/06) 行政院環境保護署,「溫室氣體盤查與登錄指引」,(2009/12) 行政院環境保護署,「溫室氣體盤查議定書:企業會計與報告標準」,(2005/05) 行政院環境保護署、台灣半導體產業協會,「全氟化物排放減量合作備忘錄」,(2005/07) 行政院環境保護署溫室氣體減量管制網 ( http://www.epa.gov.tw/ ) ,(2010/07/10) 社團法人中華民國企業永續發展協會,「2009 邁向哥本哈根COP15 氣候變遷國際談判系列報導」,(2009/11) 呂慶慧,「全球半導體產業PFCs排放減量現況技術報導」,台灣半導體產業協會會刊,十月號(2006) 林俊男,「半導體業PFC減量計劃」,台灣半導體產業協會,(2003) 許芳銘,「半導體產業協會自願性氣體減量」,電子業自願性溫室氣體減量研討會,(2009/07) 許芳銘,「對政府的氣候立法建言」,COP15之後的國際氣候政策與立法趨勢論壇,(2010/4) 黃仕杰,申永順,「清潔發展機制之外加性論證與國內應用觀點之研析」,工業污染防治第109期,p.217-246 (2009/06) 黃惠妙,「因應氣候變遷之二氧化碳削減策略:以半導體業為例」,南華大學環境管理研究所碩士論文,(2008/02) 黃彥瑋,「溫室氣體盤查減量策略與技術資料庫之建立」,國立交通大學環境工程系所碩士論文,(2008/07) 張碧蓮,「溫室氣體排放調查與減量研究-以某TFT-LCD廠為例」,國立交通大學工學院產業安全與防災學程碩士論文,(2006/01) 曾能芳,「水蒸氣電漿火炬設備處理半導體蝕刻製程廢氣效率之初步研究」,國立中央大學環境工程研究所碩士在職專班論文,(2006/07) 湯奕華,「工業局推廣企業社會責任報告書資源與方法介紹」,企業社會責任宣導活動,(2009/5) 湯奕華,「企業CSR報告建製方法與策略」,企業社會責任報告書製作研習,(2009/6) 經濟部工業局產業節能減碳資訊網 ( http://proj.moeaidb.gov.tw/ghg/index.asp ) , (2010/07/10) 經濟部標準檢驗局,「國內溫室氣體盤查驗證現況報告」,認證制度實施與發展計畫,(2006/11) 劉世尹,「半導體廠PFCs及VOCs廢氣排放處理之研究」,國立中央大學化學工程與材料工程研究所博士論文,(2008/07) 簡慧貞、盧裕倉、呂鴻光、胡文正,「國家溫室氣體統計之政策啟發及應用」,工業污染防治第109期,p.111-144 (2009/06) 羅時芳、楊智凱、劉彥蘭、洪嘉苹,「溫室氣體減量政策對產業發展之影響及因應對策」,中華經濟研究院,(2006/12) Laurie S. Beu Consulting, Austin, TX,「Reduction of Perfluorocompound (PFC) Emissions: 2005 State-of-the-Technology Report , International SEMATECH Manufacturing Initiative, (2005) Intergovernmental Panel on Climate Change (http://www.ipcc.ch/publications_and_data/ar4/syr/zh/main.html) , (2010/08/02) U.S. Energy Information Administration ( http://www.eia.doe.gov/oiaf/ieo/highlights.html ) , (2010/08/02)
摘要: 近年來全球暖化議題已漸受重視,溫室效應對全球氣候變遷的影響也日益嚴重。自京都議定書正式生效後,國際間持續協商後京都時期之減量責任。為因應國際市場需求與碳交易發展,因此必須落實減量政策,以達成國家減量目標。企業應先行自願性減碳,並建制完整溫室氣體盤查資料庫,以更積極的實際行動進行各項減量工作。 本研究針對某半體廠2007~2009年溫室氣體盤查結果進行分析,該半導體廠A、B、C三廠之能源間接排放佔總排放量約87%,而非PFCs與PFCs直接排放量分別佔8%、5%。2009年受金融海嘯影響,總產能較2008年減少約56%,但年度總電力排放強度2009年卻較2008年增加47%,顯示能源間接排放並未隨產能減量而減少。PFCs的產生強度 (ton/m2) 分別為1.61、1.75、1.75,排放強度 (ton/m2) 分別為0.29、0.22、0.31,顯示產能的增減並不直接影響排放強度的變化。2007年直接排放的非PFCs部份約為2008年及2009年的二倍,N2O排放量過高為主要因素。該半導體廠PFCs總排放量總計0.0197 MMTCE,低於排放目標0.028 MMTCE。盤查結果Local scrubber採樣機台、IPCC公佈之計算式、廠務電盤絕緣用之SF6均為PFCs削減率均未達90%之影響因素。 半導體產業特性需不斷的增加產能來保有市場佔有率,因此增加產能利用率並藉由製程微縮增加產出面積,期能達到排放量減緩上昇的趨勢。能源間接排放中大部份電力用來維持廠房運作,除實際降低產業能源間接排放的強度比例,更仰賴國家綠色能源的發展。在國際局勢、國內政策及經濟誘因下,企業先行自願性減碳以塑造良好企業形像,並期於政府法令及各項碳交易實施後,能得以抵換碳權搶得市場先機。
The globe warming issues have gradually been emphasized and spotlighted in modern days; however, the green house effect influences the global climate fluctuation fiercely as well. All countries constantly keep negotiating the obligations of reduction of air pollutants emission for the post Kyoto period ever since the Kyoto protocol took effects. The carbon reduction policy must be fulfilled absolutely in order to achieve the national carbon reduction requirement in accordance with further demands from international markets and expansion of carbon trading. The enterprises themselves are supposed to take action on carbon reduction voluntarily, establishing the integrated greenhouse gas database; furthermore, even carrying them out in practical action positively. This research reflects the realistic result of greenhouse gas database from anonymous semiconductor factory since 2007 to 2009. The indirect emission expelled from 3 plants (A, B, C) of semiconductor is about 87% in total. However, the non-PFCs and PFCs of direct emission is 8%, 5%, respectively. The total capacity probably deducted about 56% in comparison to identical period in 2008 contributing to the financial crisis in 2009. However, the annual total emission intensity of electricity in 2009 certainly increases 47% compared to 2008, it ends up to be a consequence that the indirect energy emission doesn't plunge exactly following up the reduction of capacity accordingly. The generation intensity (ton/m2) of PFCs is separately shown 1.61, 1.75, and 1.75 corresponding to 0.29, 0.22, 0.31 referred to emission intensity (ton/m2). It also comes to a conclusion that whatever the decreasing or increasing occurred in capacity, it won't affect the fluctuation of the emission intensity straightly. The direct emission for non PFCs in 2007 is twice than that in 2008 either 2009. The primary factor is supposed to be contributed to over enormous N2O released. The gross emission of PFCs for semiconductor industry is counted for 0.0197 MMTCE, actually is below the normal standard 0.028 MMTCE actually. The factor that causes the reduction rate of PFCs producing to attain less than 90% could be contributed to the followings: Random sampling machine of Local scrubber, equations published by IPCC, and SF6 utilized in the control panel. The fact shows that capacities for semiconductor manufacturer should be kept growing than ever in order to protect its original market share from other competitors. Therefore, to raise the capacity utilization, to increase space square of final production through process miniature, through the measures mentioned above, it could be anticipated by public to fulfill the target of reducing raising-emission. Majority of the electricity is utilized to keep facilities in operation in indirect energy emission circumstance, besides the action taken to reduce the ratio of emission strength in indirect energy emitting, it also relies on innovation and prosperity of national green energy research. Base on the current international circumstance, domestic policy and economic incentives, the enterprises are in a bid to resin their previous burden and represent good commercial images in a way of declining energy utilization; meanwhile, all the public looks forward to competing for the share of market by exchanging carbon right after the government regulations and carbon deals are implemented.
URI: http://hdl.handle.net/11455/5755
其他識別: U0005-1708201023495300
文章連結: http://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-1708201023495300
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