Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/58925
標題: 黏度隨溫度變化之流體於平行板間的動量傳遞研究
A Study of Momentum Transfer for the Flow between Parallel Plates with Viscosity Varying with Temperature
作者: 鄭文桐
關鍵字: 基礎研究
Electronic packaging
化學工程類
電子構裝
非牛頓流體
動量傳遞
印刷電路板
Non-Newtonian fluid
Momentum transfer
Printed circuit board
URI: http://hdl.handle.net/11455/58925
其他識別: NSC88-2214-E005-010
文章連結: http://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=438487&plan_no=NSC88-2214-E005-010&plan_year=88&projkey=PB8802-1090&target=plan&highStr=*&check=0&pnchDesc=%E9%BB%8F%E5%BA%A6%E9%9A%A8%E6%BA%AB%E5%BA%A6%E8%AE%8A%E5%8C%96%E4%B9%8B%E6%B5%81%E9%AB%94%E6%96%BC%E5%B9%B3%E8%A1%8C%E6%9D%BF%E9%96%93%E7%9A%84%E5%8B%95%E9%87%8F%E5%82%B3%E9%81%9E%E7%A0%94%E7%A9%B6
Appears in Collections:化學工程學系所

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