Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/58925
DC FieldValueLanguage
dc.contributor.author鄭文桐zh_TW
dc.contributor.other行政院國家科學委員會zh_TW
dc.contributor.other中興大學化學工程系zh_TW
dc.date2000zh_TW
dc.date.accessioned2014-06-06T13:19:34Z-
dc.date.available2014-06-06T13:19:34Z-
dc.identifierNSC88-2214-E005-010zh_TW
dc.identifier.urihttp://hdl.handle.net/11455/58925-
dc.language.isozh_TWzh_TW
dc.relation.urihttp://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=438487&plan_no=NSC88-2214-E005-010&plan_year=88&projkey=PB8802-1090&target=plan&highStr=*&check=0&pnchDesc=%E9%BB%8F%E5%BA%A6%E9%9A%A8%E6%BA%AB%E5%BA%A6%E8%AE%8A%E5%8C%96%E4%B9%8B%E6%B5%81%E9%AB%94%E6%96%BC%E5%B9%B3%E8%A1%8C%E6%9D%BF%E9%96%93%E7%9A%84%E5%8B%95%E9%87%8F%E5%82%B3%E9%81%9E%E7%A0%94%E7%A9%B6en_US
dc.subject基礎研究zh_TW
dc.subjectElectronic packagingen_US
dc.subject化學工程類zh_TW
dc.subject電子構裝zh_TW
dc.subject非牛頓流體zh_TW
dc.subject動量傳遞zh_TW
dc.subject印刷電路板zh_TW
dc.subjectNon-Newtonian fluiden_US
dc.subjectMomentum transferen_US
dc.subjectPrinted circuit boarden_US
dc.title黏度隨溫度變化之流體於平行板間的動量傳遞研究zh_TW
dc.titleA Study of Momentum Transfer for the Flow between Parallel Plates with Viscosity Varying with Temperatureen_US
dc.typeResearch Reportszh_TW
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