Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/59139
標題: 無鉛銲點於熱應力作用下之可靠性研究、機制探討、與改良措施分析( II )
Lead-Free Solder Joints under Thermal Stress: Reliability Study, Mechanism Discussion, and Improvement Strategy Analysis
作者: 陳志銘
關鍵字: 應用研究
材料科技
URI: http://hdl.handle.net/11455/59139
其他識別: NSC100-2628-E005-002
文章連結: http://grbsearch.stpi.narl.org.tw/GRB/result.jsp?id=2354010&plan_no=NSC100-2628-E005-002&plan_year=100&projkey=PB10008-0488&target=plan&highStr=*&check=0&pnchDesc=%E7%84%A1%E9%89%9B%E9%8A%B2%E9%BB%9E%E6%96%BC%E7%86%B1%E6%87%89%E5%8A%9B%E4%BD%9C%E7%94%A8%E4%B8%8B%E4%B9%8B%E5%8F%AF%E9%9D%A0%E6%80%A7%E7%A0%94%E7%A9%B6%E3%80%81%E6%A9%9F%E5%88%B6%E6%8E%A2%E8%A8%8E%E3%80%81%E8%88%87%E6%94%B9%E8%89%AF%E6%8E%AA%E6%96%BD%E5%88%86%E6%9E%90%28+II+%29
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