Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/67585
標題: Investigation of thin film end-termination on multilayer ceramic capacitors with base-metal-electrode
作者: Lee, Y.C.
薛富盛
Lu, W.H.
Shieu, F.S.
關鍵字: MLCC
Dissipation factor
X7R/BME
Thin film
End-termination
Tensile
strength
copper
titanium
adhesion
ambient
sio2
期刊/報告no:: Ceramics International, Volume 35, Issue 2, Page(s) 869-874.
摘要: The thin film of copper, chromium and titanium as end-termination studies were performed on multi layer ceramic capacitors (MLCCs) based on BaTiO(3) ceramic with nickel internal electrodes. A green sheet was prepared by tape casting using the X7R/BME powders. Nickel paste was attached to the green sheet as an internal electrode. After lamination, the green chips were sintered at 1300 degrees C for 2 h, then the external electrodes were sputtered as thin films for end-termination. There is no extra curing process, so that thermal shock of the MLCCs is reduced. To improve the adhesion between thin film end-termination and dielectric body, chromium and titanium were applied as media in this study. The mechanical and electrical properties of the MLCCs were investigated subsequently. The results showed that end-termination with chromium/copper has good performances on electrical and mechanical properties of MLCC, compared to conventional end-termination. (C) 2008 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
URI: http://hdl.handle.net/11455/67585
ISSN: 0272-8842
文章連結: http://dx.doi.org/10.1016/j.ceramint.2008.03.016
Appears in Collections:工學院

文件中的檔案:

取得全文請前往華藝線上圖書館



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.