Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/67602
標題: Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers
作者: Huang, K.C.
薛富盛
Shieu, F.S.
Huang, T.S.
Lu, C.T.
Chen, C.W.
Tseng, H.W.
Cheng, S.L.
Liu, C.Y.
關鍵字: Interfacial reactions
Sn(Cu) solder
bump metallization
sn
joints
reliability
substrate
cu
期刊/報告no:: Journal of Electronic Materials, Volume 39, Issue 11, Page(s) 2403-2411.
摘要: The interfacial reactions between electroplated Ni-yCo alloy layers and Sn(Cu) solders at 250 degrees C are studied. For pure Co layers, CoSn(3) is the only interfacial compound phase formed at the Sn(Cu)/Co interfaces regardless of the Cu concentration. Also, the addition of Cu to Sn(Cu) solders has no obvious influence on the CoSn(3) compound growth at the Sn(Cu)/Co interfaces. For Ni-63Co layers, (Co,Ni,Cu)Sn(3) is the only interfacial compound phase formed at the Sn(Cu)/Ni-63Co interfaces. Unlike in the pure Co layer cases, the Cu additives in the Sn(Cu) solders clearly suppress the growth rate of the interfacial (Co,Ni,Cu)Sn(3) compound layer. For Ni-20Co layers, the interfacial compound formation at the Sn(Cu)/Ni-20Co interfaces depends on the Cu content in the Sn(Cu) solders and the reflow time. In the case of high Cu content in the Sn(Cu) solders (Sn-0.7Cu and Sn-1.2Cu), an additional needle-like interfacial (Ni(x),Co(y),Cu(1-x-y))(3)Sn(4) phase forms above the continuous (Ni(x),Cu(y),Co(1-x-y))Sn(2) compound layer. The Ni content in the Ni-yCo layer can indeed reduce the interfacial compound formation at the Sn(Cu)/Ni-yCo interfaces. With pure Sn solders, the thickness of the compound layer monotonically decreases with the Ni content in the Ni-yCo layer. As for reactions with the Sn(Cu) solders, as the compound thickness decreases, the Ni content in the Ni-yCo layers increases.
URI: http://hdl.handle.net/11455/67602
ISSN: 0361-5235
文章連結: http://dx.doi.org/10.1007/s11664-010-1346-6
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